Device Substrate Debonding via Solvent Through Openings

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Solution Overview

Problem

Conventional methods for bonding and debonding device substrates, such as semiconductor wafers, require specialized materials and equipment, leading to increased costs and potential stress or cracking due to non-integrated heat or pressure conditions, limiting throughput and efficiency.

Innovation Solution

A method involving bonding a device substrate to a carrier substrate using a polymeric material with openings, allowing material removal and subsequent exposure of the polymeric material to a substance through these openings to debond the substrate, utilizing conventional equipment and widely available polymers to reduce costs and minimize stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional bonding and debonding methods are used, then substrate processing can be performed, but specialized bonding materials and debonding tools are required which increase cost and limit availability

Engineering Contradiction:

Improveavailability of bonding materials and equipmentVSAvoidspecialized materials and equipment requirements

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent uses conventional photopolymer materials that can be cured by standard UV or visible light sources, making the bonding process compatible with existing semiconductor manufacturing equipment. The same equipment can be used for both bonding and subsequent processing steps, eliminating the need for specialized debonding tools and reducing overall system complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent employs conventional photopolymer materials that are widely available and relatively inexpensive compared to specialized bonding materials. These materials can be easily applied and removed without requiring expensive specialized tools, reducing both material and equipment costs.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Ease of operation

If heat or pressure is applied to debond the substrate, then debonding can be achieved, but cracks or stress may be induced in the device substrate

Engineering Contradiction:

Improvedebonding capabilityVSAvoidstress or cracking in substrate

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical or thermal debonding methods with a chemical/photochemical approach. The photopolymer material is designed to be soluble in specific solvents, allowing debonding to occur through chemical dissolution rather than mechanical force or thermal stress, thereby preventing substrate damage.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a solvent as an intermediary substance that facilitates debonding by dissolving the photopolymer material. This intermediary enables gentle separation of the substrate from the carrier without direct application of stress or heat to the substrate itself.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If specialized carrier substrates are used, then substrate processing can be supported, but costs increase due to specialized materials and low throughput

Engineering Contradiction:

Improvesubstrate support during processingVSAvoidthroughput and cost efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent controls the bonding and debonding processes by changing the state of the photopolymer material through light exposure and solvent application. The material transitions from a bonded state (when cured) to a debonded state (when exposed to solvent), allowing reliable substrate support during processing while enabling easy removal for high throughput.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces costs and minimizes stress on the substrate by using conventional materials and equipment, improving throughput and substrate integrity during processing.

Implementation Method 1

at least a portion of the polymeric material disposed between the first surface and the carrier substrate is exposed to a substance through at least some first openings to debond the device substrate from the carrier substrate

Methodology Applied

Scientific EffectSolvent dissolution: Solvation

Implementation Method 2

bonding a first surface of a device substrate to a carrier with a polymeric material

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9099482B2Method of processing a device substrate

Publication Date: 2015.08.04 ADEIA SEMICON TECH LLC

AI summary

Methods of processing a device substrate are disclosed herein. In one embodiment, a method of processing a device substrate can include bonding a first surface of a device substrate to a carrier with a polymeric material. The device substrate may have a plurality of first openings extending from the first surface towards a second surface of the device substrate opposite from the first surface. Then, material can be removed at the second surface of the device substrate, wherein at least some of the first openings communicate with the second surface at least one of before or after performing the removal of the material. Then, at least a portion of the polymeric material disposed between the first surface and the carrier substrate can be exposed to a substance through at least some first openings to debond the device substrate from the carrier substrate.