Substrate Support Deformation Sensing for Reliable Wafer Transfer
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Solution Overview
Problem
Existing substrate processing technologies face challenges in detecting and managing substrate deformation, such as warpage, which can lead to transfer errors and damage during semiconductor manufacturing.
Innovation Solution
A substrate processing apparatus equipped with support portions that are partially deformed by contact with the substrate, integrated with deformation detectors and a controller to specify the degree of deformation, allowing for real-time monitoring and control of substrate transfer operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate deformation is not detected, then transfer operations continue without interruption, but transfer errors and substrate damage occur
Solution Approach 1:
The deformation detection is performed before the transfer operation to predict potential transfer errors. By detecting substrate deformation in advance using the support portion deformation as an indicator, the system can determine whether to proceed with or cancel the transfer operation, preventing transfer errors and substrate damage before they occur.
2Reliability
If deformation detection system is added, then transfer errors are prevented, but device complexity increases
Solution Approach 1:
The support portion serves a dual function: it provides mechanical support for the substrate during transfer operations and simultaneously acts as a deformation sensor. By utilizing the existing support portion structure and detecting its deformation, the system achieves deformation detection without requiring separate, complex detection hardware, thus minimizing the increase in device complexity.
3Reliability
If substrate deformation is detected and transfer is cancelled, then substrate damage is minimized, but productivity decreases
Solution Approach 1:
The system implements a feedback mechanism where deformation detection results directly influence transfer operation decisions. When deformation exceeds a predetermined threshold, the transfer operation is cancelled to prevent substrate damage. This feedback-based decision-making ensures substrate handling safety while minimizing unnecessary cancellations, thereby maintaining productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate detection and management of substrate deformation, preventing transfer errors and minimizing damage by controlling the transfer process based on deformation data, thus ensuring reliable substrate handling and processing.
Implementation Method 1
one or more support portions configured to support the substrate and disposed at portions of the substrate placing portion that are brought into contact with the substrate, said one or more support portions being at least partially deformed by the contact with the substrate
Data Source
AI summary
This substrate processing apparatus is provided with: a substrate placing portion on which a substrate is placed; one or more support portions configured to support the substrate and disposed at portions of the substrate placing portion that are brought into contact with the substrate, said one or more support portions being at least partially deformed by the contact with the substrate; a detector configured to detect deformation of the support portion; and a controller configured to specify a degree of the deformation of the substrate based on the detection result of the detector.