Laminated Substrate Delamination via Segmented Suction and Sharp Member
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Solution Overview
Problem
The existing delamination methods for semiconductor substrates are inefficient due to the point-wise application of force, which can lead to warping or cracking during the transfer and grinding processes, particularly for large and thin substrates, and there is a need for improved efficiency in the delamination process, especially in semiconductor device manufacturing and SOI substrate production.
Innovation Solution
A delamination method and system that uses a holding unit to position the substrate, a sharp member to form a delamination start point on the substrate's side surface, and suction movement units to progressively delaminate the substrates, ensuring a controlled and efficient separation from one end to the other, reducing the risk of substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the peripheral portion of the holding unit is moved vertically at only one point, then the device complexity is reduced, but the delamination efficiency deteriorates and force is not distributed evenly
Solution Approach 1:
The holding unit is divided into multiple independent suction movement units (first, second, and third suction movement units), each capable of moving independently in the vertical direction. This segmentation allows distributed force application across multiple points simultaneously, improving delamination efficiency while maintaining relatively simple individual unit structures
Solution Approach 2:
Multiple suction movement units are combined within a single holding unit structure to work together on the same substrate. The first, second, and third suction movement units cooperate to apply delamination force at multiple locations simultaneously, achieving both distributed force application and efficient processing
2Device complexity
If point-wise force application is used during delamination, then the device complexity is reduced, but the substrate stability deteriorates causing warping or cracking
Solution Approach 1:
The force application mechanism is segmented into multiple independent suction movement units that can apply force at different locations simultaneously. This distributes the mechanical stress across the substrate rather than concentrating it at a single point, preventing warping and cracking while maintaining manageable device complexity
Solution Approach 2:
Different regions of the substrate receive force application at different locations and times through the coordinated movement of multiple suction units. The first suction movement unit handles one end portion while the second and third units handle other portions, creating localized force application patterns that maintain substrate stability
3Productivity
If multiple suction movement units are used to delaminate progressively, then the delamination efficiency is improved, but the device complexity increases
Solution Approach 1:
Each suction movement unit is designed with multi-functionality, serving both as a holding mechanism and a force application device. The same suction units that grasp the substrate also apply delamination force, eliminating the need for separate specialized components and reducing overall device complexity
Solution Approach 2:
The suction movement units are designed to move dynamically and independently in the vertical direction during the delamination process. This dynamic capability allows the system to adapt to different substrate conditions and delamination stages, improving efficiency while the modular dynamic design keeps complexity manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and system enhance the efficiency and stability of the delamination process, reducing the risk of substrate warping or cracking and allowing for more precise control over the delamination process, thereby improving the overall manufacturing efficiency and substrate quality.
Implementation Method 1
a plurality of suction movement units which sucks the second substrate of the laminated substrate and moves the second substrate away from the first substrate
Data Source
AI summary
A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.