Substrate Delivery Segmentation for Wafer Transfer Efficiency

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Solution Overview

Problem

The existing substrate processing systems face limitations in increasing the number of wafers transferred per unit time due to increased moving distances of the substrate delivery apparatuses, which hinders efficient processing.

Innovation Solution

The system incorporates multiple first and second accommodating units stacked in a height direction, with dedicated first and second transfer apparatuses and delivery apparatuses that directly access specific units, reducing moving distances and optimizing the transfer process by arranging the first accommodating units at a middle height position and the second accommodating units on and below them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single substrate delivery apparatus transfers substrates between lower and upper accommodation positions, then the system structure is simplified, but the moving distance of the delivery apparatus is increased

Engineering Contradiction:
Improvesystem structureVSAvoidmoving distance of delivery apparatus
Core Design Contradiction:
Device complexityVSLength of moving object

Solution Approach 1:

The patent divides the substrate delivery system into two separate delivery apparatuses: a first delivery apparatus for the upper group and a second delivery apparatus for the lower group. Each apparatus is responsible for delivering substrates to specific accommodation positions, thereby segmenting the delivery function to reduce individual moving distances and improve transfer efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a height dimension differentiation by placing first accommodating units at upper positions and second accommodating units at lower positions. This vertical arrangement allows delivery apparatuses to operate at optimized height levels, reducing the vertical travel distance compared to a single apparatus serving both upper and lower positions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If a single substrate delivery apparatus serves both upper and lower accommodation positions, then the number of components is reduced, but the number of wafers transferred per unit time is limited

Engineering Contradiction:
Improvenumber of componentsVSAvoidnumber of wafers transferred per unit time
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent segments the substrate delivery function into parallel operations by providing separate first and second delivery apparatuses. The first delivery apparatus delivers substrates to upper accommodating units while the second delivery apparatus delivers to lower accommodating units simultaneously, enabling parallel substrate transfer operations that increase the number of wafers transferred per unit time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent enables continuous substrate delivery operations by having multiple delivery apparatuses work in parallel without interfering with each other. While the first delivery apparatus operates on the upper level, the second delivery apparatus operates on the lower level, ensuring continuous and uninterrupted substrate supply to processing units, thereby maximizing productivity.

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If multiple delivery apparatuses are introduced to reduce moving distances, then the number of wafers transferred per unit time increases, but the system complexity increases

Engineering Contradiction:
Improvenumber of wafers transferred per unit timeVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments both the delivery apparatuses and accommodating units into grouped configurations. First delivery apparatuses are paired with first accommodating units for the upper group, while second delivery apparatuses are paired with second accommodating units for the lower group. This segmented architecture manages system complexity by creating modular, independently operable units rather than a monolithic complex system.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10236196B2Substrate processing system
Publication Date: 2019.03.19 TOKYO ELECTRON LTD
  • US10236196B2 patent drawing
  • US10236196B2 patent drawing
  • US10236196B2 patent drawing

AI summary

A substrate processing system is provided. The substrate processing system includes: a first transfer apparatus; at least two first accommodating units including an upper first accommodating unit and a lower first accommodating unit; multiple first substrate processing units, which are divided into at least a first group and a second group and arranged in a height direction; an upper second accommodating unit corresponding to the first group; an upper second transfer apparatus corresponding to the first group; a lower second accommodating unit corresponding to the second group; a lower second transfer apparatus corresponding to the second group; a first delivery apparatus corresponding to the first group; and a second delivery apparatus corresponding to the second group.