Substrate Deposition Monitoring for Non-Line-of-Sight Recesses
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for monitoring chemical-dose deposition and substrate process results in non-line-of-sight (non-LOS) surfaces are time-consuming and resource-intensive, often requiring destructive techniques like cross-sectional scanning electron microscopy (SEM) or transmission electron microscopy (TEM), which render the substrate unfit for reuse.
Innovation Solution
The development of devices and systems that enable non-destructive monitoring of chemical-dose deposition in non-LOS surfaces through the use of enclosure structures and machine learning models to analyze reflected light data, allowing for real-time process result prediction and adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive techniques like cross-sectional SEM or TEM are used to monitor chemical-dose deposition in non-LOS surfaces, then measurement precision is improved, but the substrate is rendered unfit for reuse and processing time increases
Solution Approach 1:
The patent replaces destructive mechanical/physical analysis methods (cross-sectional SEM, TEM) with optical detection methods. The system uses reflected light intensity measurements to monitor deposition depth in non-LOS recesses, enabling non-destructive, real-time monitoring that preserves substrates for reuse and eliminates time-consuming destructive analysis steps
Solution Approach 2:
The substrate itself serves as the monitoring target by reflecting light from its deposited surfaces. The reflected light intensity naturally correlates with deposition depth, allowing the substrate to provide its own monitoring signal without requiring external destructive analysis, thereby enabling rapid assessment and substrate reuse
2Measurement precision
If destructive techniques are used for deposition monitoring, then measurement precision is improved, but resource consumption increases
Solution Approach 1:
The patent substitutes destructive physical analysis (SEM, TEM) with non-destructive optical measurement. Light reflection intensity from deposited surfaces provides sufficient measurement precision to monitor chemical-dose deposition in non-LOS surfaces without consuming or damaging the substrate, preserving it for reuse and reducing resource waste
Solution Approach 2:
The system creates an optical copy or representation of the deposition state through reflected light intensity measurements. This optical signal serves as a surrogate for direct physical measurement, providing accurate deposition monitoring information without requiring physical extraction or destruction of substrate material
3Measurement precision
If conventional monitoring methods are used, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex vacuum-based analytical instruments (SEM, TEM) with a simpler optical measurement system. The monitoring device uses light sources and detectors to measure reflected light intensity from substrate surfaces, providing comparable measurement precision with significantly reduced system complexity and eliminating the need for specialized vacuum equipment
Solution Approach 2:
The patent introduces light as an intermediary medium to transfer information about deposition depth from the non-LOS surfaces to the detector. This optical intermediary enables measurement without direct physical contact or complex vacuum analysis equipment, simplifying the monitoring system while maintaining measurement accuracy
4Productivity
If real-time monitoring is implemented, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent implements real-time monitoring by replacing complex post-processing analysis (SEM, TEM) with immediate optical measurement during or after deposition. The reflected light intensity provides instantaneous feedback on deposition depth, enabling real-time process control and rapid substrate reuse decisions without requiring complex analytical equipment
Solution Approach 2:
The system implements feedback by measuring reflected light intensity and using this information to monitor deposition progress in real-time. This feedback mechanism enables immediate assessment of chemical-dose deposition in non-LOS surfaces, allowing for rapid process adjustments and substrate reuse decisions that improve productivity without requiring complex monitoring infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid, non-destructive assessment of deposition processes in complex geometries, improving process control and reducing downtime by providing real-time feedback for optimizing chamber operations.
Implementation Method 1
The first interior volume is configured to direct a first mass transport (e.g., chemical diffusion with or without gas-phase convection) of a reactive species to a first surface of the substrate
Implementation Method 2
The first interior volume is configured to direct a first mass transport (e.g., chemical diffusion with or without gas-phase convection) of a reactive species to a first surface of the substrate
Implementation Method 3
A second portion of the lower interior surface forms a channel configured to provide a second mass transport of the reactive species to a second surface of the substrate opposite the first surface
Data Source
AI summary
Assemblies, system, methods, and devices for monitoring characteristics of a substrate disposed in a recess within a processing chamber. An assembly includes an enclosure structure forming an interior volume configured to support a substrate disposed within the interior volume. The substrate may be selectively removed from the enclosure structure. The enclosure structure may include an upper interior surface and a lower interior surface located below the upper interior surface. The interior volume is configured to direct a first mass transport of a reactive species to a first surface of the substrate, the reactive species corresponding to a substrate process. A first portion of the lower interior surface is configured to support the substrate. A second portion of the lower interior surface forms a channel configured to provide a second mass transport of the reactive species to a second surface of the substrate opposite the first surface.