Package Substrate Depression Layout for Electric Field Shielding
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Solution Overview
Problem
Existing packaged integrated circuits (ICs) face challenges in increasing substrate thickness to reduce electric field leakage, which can affect external components and safety, while also needing to accommodate various circuit components and tools' thickness limitations.
Innovation Solution
A method for manufacturing a packaged IC with a thick package substrate featuring depressions that contain components like inductors and magnetic mold compounds, allowing for a compact design by reducing the overall height and facilitating handling, while maintaining reduced electric field leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the substrate thickness is increased to reduce electric field leakage, then electric field shielding performance is improved, but the overall package height increases and tool compatibility is compromised
Solution Approach 1:
The substrate thickness is varied locally to provide different functions in different regions. The first substrate layer maintains a first thickness for electric field shielding, while the second substrate layer has a second thickness for component accommodation and tool compatibility. This local differentiation resolves the contradiction by allowing the substrate to be thick where needed for shielding and thin where needed for tool access.
Solution Approach 2:
The invention transitions from a uniform thickness design to a multi-layered thickness design, adding the dimension of vertical stratification. By creating distinct first and second substrate layers with different thicknesses, the solution addresses both the shielding requirement (first layer) and the tool compatibility requirement (second layer) simultaneously.
2Quantity of substance
If the substrate thickness is increased to accommodate thicker metal interconnects, then current carrying capacity is improved, but the package height increases and handling becomes difficult
Solution Approach 1:
Thicker metal interconnects are provided in the first substrate layer for high current applications, while the second substrate layer maintains a reduced thickness for ease of handling. This local differentiation allows the package to carry high currents where needed without compromising overall handleability.
3Adaptability or versatility
If components are placed on the substrate surface, then component integration is achieved, but the package height increases
Solution Approach 1:
The invention utilizes the vertical dimension by creating a multi-layered substrate structure. Components can be integrated in the first substrate layer while the second substrate layer provides a reduced height profile, allowing component integration without proportionally increasing overall package height.
Data Source
AI summary
In examples, a packaged integrated circuit (IC) comprises a package substrate having opposite first and second surfaces and including metal interconnects surrounded by an insulation material. The package substrate includes a depression region that extends from the first surface, and the depression region includes a material different from the insulation material and the metal interconnects. The packaged IC also comprises a semiconductor die on part of the first surface adjacent to the depression region. The semiconductor die includes circuitry coupled to the metal interconnects. The packaged IC also comprises a mold compound covering the semiconductor die and the depression region.