Substrate Development Uniformity via Localized Gas and Adjusting Liquid Supply
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform line width distribution due to discrepancies in development progress across the substrate surface, particularly between the inner and peripheral regions, leading to variations in line width after development.
Innovation Solution
A substrate processing method that involves forming a liquid film of developing liquid on the substrate, supplying gas to the inner region to accelerate development, and adjusting the development progress on the peripheral region by supplying an adjusting liquid, with the second processing starting after the first processing and ending before it, allowing for precise control of development degree between regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a developing liquid is supplied uniformly across the substrate surface, then the development processing can be performed, but the line width distribution becomes non-uniform due to discrepancies in development progress between inner and peripheral regions
Solution Approach 1:
The patent applies local quality by dividing the substrate surface into inner and peripheral regions, and supplying different liquids (gas to inner region, adjusting liquid to peripheral region) to different areas. This enables localized control of development progress, achieving uniform line width distribution across the entire substrate surface while maintaining simple processing operations.
2Manufacturing precision
If the development processing time is extended to achieve uniform development across the substrate, then the line width distribution improves, but the processing time increases
Solution Approach 1:
The patent applies preliminary action by supplying gas to the inner region before the main development process to accelerate development in that area, and supplying adjusting liquid to the peripheral region to suppress excessive development. This preliminary regional adjustment enables uniform line width distribution to be achieved within the standard processing time frame, preventing time loss while maintaining precision.
3Productivity
If the developing liquid supply rate is increased to accelerate development, then the processing efficiency improves, but the line width distribution becomes more non-uniform due to exaggerated regional differences
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition and properties of the liquids supplied to different regions. Gas is supplied to the inner region to accelerate development, while adjusting liquid with different chemical properties is supplied to the peripheral region to suppress development. This parameter modification enables high processing efficiency to be maintained while achieving uniform line width distribution across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables easy adjustment of line width distribution across the substrate surface by controlling the gas and adjusting liquid supply, improving in-plane uniformity without altering the processing time, thus enhancing the accuracy and efficiency of the development process.
Implementation Method 1
a first processing of supplying a gas to an inner region located at an inner side than a peripheral region on the surface of the substrate
Implementation Method 2
a second processing of supplying an adjusting liquid configured to suppress progress of the development on the peripheral region
Data Source
AI summary
A substrate processing method includes performing a developing processing on a substrate. The developing processing includes supplying a developing liquid on a surface of the substrate to form a liquid film of the developing liquid on the surface of the substrate; maintaining the liquid film on the surface such that development progresses; and performing, during the maintaining of the liquid film, a first processing of supplying a gas to an inner region located inward of a peripheral region on the surface of the substrate and a second processing of supplying an adjusting liquid configured to suppress progress of the development on the peripheral region to adjust a degree of the development between the peripheral region and the inner region. The second processing is started after a start time of the first processing, and the second processing is ended after an end time of the first processing.