Semiconductor Substrate Dicing with Notches for Crack Propagation
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Solution Overview
Problem
The existing laser dicing process for semiconductor chips often results in non-dicing failures due to the inability to effectively propagate cracks through the substrate, leading to incomplete separation of semiconductor chips.
Innovation Solution
The method involves forming notch portions and modified patterns on the substrate, which are then used to propagate cracks along dicing lines, allowing for precise separation of semiconductor chips by inducing stress and facilitating crack propagation through the organic matter layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If laser dicing is used to replace blade dicing, then substrate consumption is reduced, but non-dicing failures increase due to inability to effectively propagate cracks
Solution Approach 1:
The patent applies preliminary action by forming notches and modified patterns on the substrate surface before performing laser dicing. These pre-formed structures serve as stress concentration points that guide and facilitate crack propagation during the subsequent laser dicing process, ensuring complete chip separation while maintaining the advantages of laser dicing such as reduced substrate consumption.
Solution Approach 2:
The patent implements local quality by creating specific regions with different properties: notches that penetrate the organic matter layer to expose the underlying substrate, and modified patterns with altered physical properties (such as different refractive indices or stress characteristics). These localized modifications create preferential paths for crack propagation only where needed, without affecting the overall substrate integrity or requiring blade dicing.
2Reliability
If traditional blade dicing is used, then complete separation is achieved, but substrate consumption increases and manufacturing complexity increases
Solution Approach 1:
The patent replaces the mechanical blade dicing system with a laser-based system that utilizes optical energy to induce and propagate cracks. By substituting mechanical contact with optical field interaction, the process eliminates the need for physical blades while achieving complete chip separation through controlled crack propagation along the dicing lines.
Solution Approach 2:
The patent employs parameter changes by modifying the physical and chemical properties of specific regions on the substrate through the formation of notches and modified patterns. These parameter changes (such as stress distribution, refractive index, or material density) create controlled weak points that guide crack propagation, enabling laser dicing to achieve blade-dicing-level separation completeness with reduced substrate consumption.
3Productivity
If laser dicing is applied directly without preliminary modifications, then processing speed is maintained, but crack propagation fails leading to dicing failures
Solution Approach 1:
The patent performs preliminary actions by forming notches and modified patterns before laser dicing to establish predetermined crack propagation paths. This preparation ensures that when laser energy is applied, cracks will propagate accurately along the desired dicing lines without deviation, maintaining both high processing speed and precise separation accuracy.
Solution Approach 2:
The notches and modified patterns act as intermediaries between the laser energy and the substrate material. These intermediary structures concentrate and guide the laser-induced stress, ensuring that crack propagation occurs precisely along the intended dicing lines rather than randomly, thereby maintaining manufacturing precision while preserving the high speed advantage of laser dicing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces dicing failures by ensuring complete separation of semiconductor chips along predetermined lines, enhancing the efficiency and reliability of the dicing process.
Implementation Method 1
forming modified patterns within the substrate; and dicing the substrate by propagating cracks into the substrate from the modified patterns
Data Source
AI summary
A method of manufacturing a semiconductor chip includes a process of dicing a substrate. A first notch portion and a second notch portion that are spaced apart from each other are formed on a surface of the substrate along a dicing line. Modified patterns are formed within the substrate. The substrate is diced by propagating cracks into the substrate from the modified patterns. The first notch portion and the second notch portion are formed to penetrate an organic matter layer of the substrate.