Uniform Discharge in Vertical Substrate Processing Systems
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Solution Overview
Problem
Conventional substrate processing systems with vertically arranged processing modules face challenges in maintaining uniform discharge conditions for process liquids, leading to non-uniform film-thickness profiles and increased complexity in troubleshooting due to varying discharge pressures and the potential for gas bubbles forming under negative pressure.
Innovation Solution
A substrate processing system with a dispensing mechanism that includes a pressurized process liquid supply source, identical-length delivery pipings, and controlled valves to ensure uniform discharge pressures across all processing modules, along with a structure that prevents bubble formation by allowing them to rise and escape, thereby maintaining consistent process conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If processing modules are vertically arranged to improve production efficiency, then productivity increases, but discharge pressure uniformity deteriorates
Solution Approach 1:
The patent divides the single pressurizing system into multiple independent pressurizing units, each corresponding to a specific processing module. This segmentation allows each module to have its own pressurizing pump and control system, ensuring uniform discharge pressure for each module while maintaining vertical arrangement for high productivity.
Solution Approach 2:
The patent implements local pressurizing control where each processing module has its own pressurizing pump that can independently adjust pressure. This local quality approach ensures that each module receives optimized pressure control tailored to its specific position and requirements, resolving the pressure uniformity issue caused by vertical arrangement.
2Ease of repair
If pumps are disposed near the bottom for easy maintenance, then ease of repair improves, but discharge pressure uniformity deteriorates
Solution Approach 1:
The patent segments the pressurizing system into multiple independent units distributed at different heights corresponding to each processing module. This eliminates the need for long piping from a bottom-mounted pump, ensuring uniform pressure delivery while maintaining ease of maintenance through modular, accessible pump units.
Solution Approach 2:
The patent transitions from a single bottom-mounted pump configuration to a multi-level distributed pump arrangement. By utilizing the vertical dimension to position pumps at appropriate heights for each module, the system achieves both pressure uniformity and maintenance accessibility.
3Adaptability or versatility
If delivery pipings have different lengths to reach different processing modules, then adaptability improves, but discharge pressure uniformity deteriorates
Solution Approach 1:
The patent divides the delivery piping system into multiple independent piping circuits, each serving a specific processing module with its own pressurizing pump. This segmentation allows each circuit to be optimized for its specific module while maintaining overall system adaptability through the modular structure.
Solution Approach 2:
The patent implements local pressurizing control where each processing module has its own pressurizing pump that can independently adjust pressure. This local quality approach ensures that each module receives optimized pressure control tailored to its specific position and requirements, resolving the pressure uniformity issue caused by vertical arrangement.
4Ease of operation
If pumps draw in process liquid by suction motion, then ease of operation improves, but bubble formation increases
Solution Approach 1:
The patent inverts the conventional suction-based liquid intake mechanism by implementing pressure-fed liquid supply. The pressurizing pumps force the process liquid into the processing modules through pressure, eliminating the negative pressure conditions that cause gas bubble formation during suction operations.
Solution Approach 2:
The patent converts the potential harm of pressure buildup into a beneficial force by using the pressurizing pumps to not only deliver the liquid but also to prevent bubble formation. The positive pressure applied during liquid supply eliminates the conditions for gas dissolution and bubble formation that occur during suction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves uniform discharge conditions for each processing module, preventing variations in film-thickness profiles and simplifying troubleshooting by maintaining consistent process parameters, while also preventing gas bubbles from forming, ensuring reliable and efficient substrate processing.
Implementation Method 1
a pressing apparatus that pressurizes the process liquid supply source to pressure-feed the process liquid
Implementation Method 2
there is a possibility that a gas (e.g., nitrogen) dissolved in the resist forms micro bubbles because of the negative pressure
Data Source
AI summary
A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.