Substrate Processing Apparatus Discharge Solution Recovery

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Solution Overview

Problem

Conventional substrate processing apparatuses face inefficiencies in recovering and reusing discharged solutions, leading to increased usage of deionized water and higher manufacturing costs due to the difficulty in achieving a sufficient concentration of discharged solutions for recycling.

Innovation Solution

A substrate processing apparatus with a processing unit, separate chemical solution supply units, and discharge lines that allow selective diversion and reuse of discharged solutions based on their resistivity, enabling the recovery and reuse of a larger amount of discharged solution by mixing it with deionized water for subsequent processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the discharged solution concentration is monitored and recovery is initiated only when concentration drops below a predetermined level, then the purity of recovered solution is improved, but the amount of recoverable solution is reduced

Engineering Contradiction:
Improvepurity of recovered solutionVSAvoidamount of recoverable solution
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The discharge solution line is divided into multiple segments with different recovery thresholds. The first discharge solution line recovers solutions above a first concentration threshold, while the second discharge solution line recovers solutions between the first and second thresholds. This segmentation allows different portions of the discharged solution to be recovered through different paths, maximizing both purity and quantity of recovered solution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system uses different concentration thresholds (parameters) for different discharge solution lines. By changing the recovery threshold parameter based on the discharge solution concentration, the system optimizes recovery at different stages of the rinsing process, thereby increasing the total amount of recoverable solution while maintaining acceptable purity levels.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If deionized water is used extensively for rinsing processes, then the cleaning effectiveness is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

Instead of discarding the discharged solution from the rinsing process, the system recovers it through the first and second discharge solution lines. The recovered solution is then reused in subsequent chemical solution processes, thereby reducing the need for continuous consumption of deionized water and chemical solutions, which directly reduces manufacturing costs while maintaining cleaning effectiveness.

Inventive Principle:
Principle #34Discarding and recovering

Solution Approach 2:

The system creates a self-sustaining circulation where discharged solution from rinsing processes is recovered and reused in chemical solution processes. This reduces the external input of fresh deionized water and chemical solutions needed, making the system more efficient and cost-effective while maintaining the required cleaning and processing quality.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS9859109B2Substrate processing apparatus, substrate processing method and computer-readable medium storing program
Publication Date: 2018.01.02 TOKYO ELECTRON LTD
  • US9859109B2 patent drawing
  • US9859109B2 patent drawing
  • US9859109B2 patent drawing

AI summary

Disclosed is a substrate processing apparatus, a substrate processing method and a computer-readable medium capable of recovering an extended amount of discharged solution from a processing unit thereby reducing the amount of deionized water for the processing and the cost. The substrate processing apparatus includes, inter alia, a first and second discharge solution lines each connected to a downstream side of a discharge unit, and the discharged solution from each of the first and second discharge solution lines is independently delivered to the processing solution supply unit as a recovered solution. Also, the substrate processing apparatus includes a converting unit that converts flow of the discharged solution from the discharge unit either to the first discharge solution line or to the second discharge solution line. The processing solution supply unit selectively delivers the recovered solution from the first and second discharge solution lines to the processing unit.