Substrate Processing Device Upward Liquid Discharge for Uniform Etching
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Solution Overview
Problem
Conventional batch-type substrate processing devices experience non-uniform film removal characteristics due to uneven etching rates across substrate surfaces, particularly when processing multiple substrates simultaneously, leading to inconsistent processing results.
Innovation Solution
A substrate processing device with a processing bath and discharge units that discharge processing liquid upward along the side surfaces, creating a circulation flow that uniformly covers the front and rear surfaces of substrates, ensuring consistent etching across all regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing liquid is supplied uniformly onto substrate surfaces, then etching rate uniformity is expected to improve, but conventional batch-type devices still exhibit non-uniform etching characteristics
Solution Approach 1:
The discharge units are positioned at the bottom of the processing bath to discharge processing liquid upward, utilizing the vertical dimension to create circulation flow that reaches all substrate surfaces uniformly. This vertical discharge approach allows processing liquid to flow along the front and rear surfaces of substrates, ensuring consistent coverage across multiple substrates disposed at predetermined intervals.
2Productivity
If multiple substrates are processed simultaneously in a batch-type device, then productivity increases, but film removal characteristics become non-uniform across substrate surfaces
Solution Approach 1:
Multiple discharge units are distributed along the bottom of the processing bath, each responsible for supplying processing liquid to specific regions. This segmentation of the discharge function ensures that processing liquid is delivered uniformly to each substrate's front and rear surfaces, maintaining consistent film removal characteristics across all substrates processed simultaneously.
3Productivity
If processing liquid flows at high speed across substrate surfaces, then processing efficiency improves, but flow uniformity across different regions becomes difficult to maintain
Solution Approach 1:
The circulation flow pattern merges multiple flow paths along the front and rear surfaces of substrates into a unified circulation system. Processing liquid discharged from bottom units flows upward and circulates along both surfaces, combining flow paths to achieve uniform high-speed flow distribution across all substrate regions, thereby maintaining both efficiency and uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uniform supply of processing liquid enhances the uniformity of film removal processes, achieving consistent etching rates and selection ratios across the entire surface of multiple substrates, thereby improving processing uniformity and efficiency.
Implementation Method 1
a stream flow of the processing liquid discharged in the upward direction from the discharge unit toward the side surface of the processing bath circulates in the processing bath along the front surfaces and the rear surfaces of the substrates
Data Source
AI summary
A substrate processing device (10) for processing a plurality of substrates disposed at predetermined intervals includes a processing bath (12) that is configured to store processing liquid, and has a side surface (13) extending along a thickness direction of the plurality of substrates, and a discharge unit (14) that is disposed in a bottom portion of the processing bath (12), and is configured to discharge processing liquid in an upward direction toward the side surface (13).