Substrate Surface Distortion Compensation for Permanent Bonding
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Solution Overview
Problem
Existing methods for compensating for distortions in semiconductor substrates are not permanent, as distortions re-emerge when controllable deformation elements are switched off or substrates are removed, leading to suboptimal bonding results.
Innovation Solution
A method and device that produce local actions on substrate surfaces to compensate for distortions, using techniques such as laser-induced physical and chemical reactions, material removal, or stress manipulation in coatings, to achieve permanent, targeted deformations that adapt the substrate surface to an intended state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If controllable deformation elements are used to compensate for distortions, then distortion compensation is achieved, but the compensation is not permanent and distortions re-emerge when elements are switched off or substrates are removed
Solution Approach 1:
The patent replaces mechanical deformation elements with laser-induced physical and chemical reactions to produce permanent substrate deformations. The laser beam (electromagnetic energy) transforms the substrate material properties through melting, vaporization, or stress manipulation, creating permanent shape changes without mechanical contact, thus eliminating the temporary nature of mechanical compensation systems.
Solution Approach 2:
The patent changes the physical and chemical parameters of the substrate through laser irradiation. By controlling laser parameters (power, pulse duration, wavelength) and substrate parameters (temperature, material composition), permanent deformations are induced that compensate for distortions. This parameter transformation approach creates stable, permanent compensation rather than temporary mechanical adjustment.
2Stability of the object's composition
If local actions are produced on substrate surfaces to compensate for distortions, then permanent changes are achieved, but the process complexity increases
Solution Approach 1:
The patent employs a multi-functional laser system that can perform multiple operations (melting, vaporization, stress manipulation) using a single device platform. The same laser apparatus can compensate for various types of distortions (local and global) by adjusting process parameters, reducing the need for multiple specialized devices and simplifying the overall system despite the complexity of the physical processes involved.
3Manufacturing precision
If substrates are ground back or polished to correct distortions, then surface accuracy is improved, but new distortions are introduced due to mechanical effects and internal stresses
Solution Approach 1:
The patent replaces mechanical grinding and polishing processes with laser-based methods. The laser beam directly modifies the substrate surface through non-contact energy deposition, inducing controlled deformations that compensate for existing distortions without introducing new mechanical stresses or contact-induced warping. This eliminates the harmful mechanical effects inherent in traditional mechanical finishing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively compensates for both local and global distortions, ensuring a stable and optimal substrate surface for subsequent process steps, including bonding, by introducing permanent changes that minimize the re-emergence of distortions.
Implementation Method 1
at least one local action is produced on at least one of the substrate surfaces... using techniques such as laser-induced physical and chemical reactions
Implementation Method 2
material removal... to achieve permanent, targeted deformations that adapt the substrate surface to an intended state
Implementation Method 3
stress manipulation in coatings, to achieve permanent, targeted deformations
Data Source
AI summary
The invention relates to a method and a device for the compensation of distortions on a substrate surface of a substrate, a method for bonding two substrates and a product.