Substrate Distortion Measurement Using Reference Profile Correction
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Solution Overview
Problem
Conventional methods for determining substrate distortion, such as repositioning substrates for measurement and simulating gravity-induced deflection, are costly, time-consuming, and prone to errors, which can impact the throughput and accuracy of substrate processing systems.
Innovation Solution
A method that involves obtaining data on the measured profile of a substrate and a reference substrate, determining a corrected substrate profile by accounting for gravity-induced deflection using the reference substrate, and performing corrective actions based on the corrected profile, thereby avoiding the need for substrate repositioning and simulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional methods (repositioning substrates or simulating gravity-induced deflection) are used to determine substrate distortion, then measurement accuracy can be achieved, but processing time increases and throughput decreases
Solution Approach 1:
The system performs preliminary characterization of the substrate support structure to establish a computational model of gravity-induced deflection. This model is then used to correct substrate profile measurements without requiring physical repositioning or time-consuming simulations, thereby maintaining measurement accuracy while improving throughput
Solution Approach 2:
The invention replaces mechanical repositioning methods and physical simulation experiments with a computational approach. By using a computational model that calculates gravity-induced deflection based on substrate support characteristics, the system eliminates the need for time-consuming mechanical operations while maintaining measurement precision
2Measurement precision
If conventional methods (repositioning substrates or simulating gravity-induced deflection) are used to determine substrate distortion, then measurement accuracy can be achieved, but system complexity and operational costs increase
Solution Approach 1:
The invention replaces complex mechanical repositioning systems and physical simulation apparatus with a computational model. The system uses software algorithms to calculate and correct for gravity-induced deflection based on substrate support characteristics, significantly reducing hardware complexity and operational costs while maintaining measurement accuracy
Solution Approach 2:
Instead of physically manipulating or repositioning substrates, the system creates a computational representation (model) of the substrate support structure and uses this digital copy to predict and correct deflection effects. This virtual modeling approach eliminates the need for complex physical manipulation systems
3Measurement precision
If conventional methods (repositioning substrates or simulating gravity-induced deflection) are used to determine substrate distortion, then measurement accuracy can be achieved, but measurement time increases
Solution Approach 1:
The system performs preliminary characterization of the substrate support structure to establish a computational model of gravity-induced deflection. This model is then used to correct substrate profile measurements without requiring physical repositioning or time-consuming simulations, thereby maintaining measurement accuracy while improving throughput
Solution Approach 2:
The invention replaces mechanical repositioning methods and physical simulation experiments with a computational approach. By using a computational model that calculates gravity-induced deflection based on substrate support characteristics, the system eliminates the need for time-consuming mechanical operations while maintaining measurement precision
Data Source
AI summary
A method includes obtaining first data indicative of a measured profile of a substrate. The method further includes obtaining second data indicative of a profile of a reference substrate. The method further includes determining a corrected substrate profile based on the first data and the second data. The method further includes performing a corrective action based on the corrected substrate profile.


