Substrate Drying Sequence for Removing Adsorbed Moisture
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Solution Overview
Problem
Conventional drying methods fail to effectively remove adsorbed moisture on substrates with increasingly finer circuit wiring in semiconductor devices, necessitating an improved substrate processing method.
Innovation Solution
A method involving forming a liquid film on the substrate surface, followed by rotating it at varying speeds to thin and remove the liquid film, then applying dry fluid and inert gas to efficiently evaporate residual moisture, reducing the amount of drying fluid required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional drying methods (spin dry or Rotagoni drying) are used, then the substrate can be dried after cleaning, but adsorbed moisture remains on the substrate surface
Solution Approach 1:
A liquid film is formed on the substrate surface before the drying process begins. This preliminary liquid film layer serves as a medium that facilitates the removal of adsorbed moisture during subsequent rotation and drying steps, addressing the limitation of conventional methods that cannot effectively remove tightly adsorbed moisture molecules.
Solution Approach 2:
The substrate rotation speed is changed from a first speed during liquid film formation to a second speed during the drying process. This parameter change optimizes the centrifugal force to effectively remove the liquid film and adsorbed moisture while preventing substrate damage, thereby improving drying effectiveness.
2Reliability
If more dry fluid is supplied to remove adsorbed moisture, then drying effectiveness improves, but environmental impact and cost increase
Solution Approach 1:
A liquid film is introduced as an intermediary substance between the substrate and the dry fluid. This liquid film acts as a mediator that facilitates moisture removal through controlled rotation and subsequent evaporation, reducing the direct need for large amounts of dry fluid while maintaining effective drying performance.
Solution Approach 2:
The liquid film on the substrate undergoes phase transition from liquid to vapor through evaporation during the drying process. This phase transition mechanism allows for effective moisture removal with reduced dry fluid consumption, as the liquid film itself contributes to the drying action through its evaporation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the removal of residual adsorbed moisture on substrates, minimizing environmental impact and costs while ensuring thorough drying.
Implementation Method 1
rotating the substrate at a first speed to supply a liquid from a liquid nozzle positioned above a center of the substrate onto the substrate for a predetermined time; stopping a supply of the liquid, rotating the substrate at a second speed after rotating the substrate at the first speed
Implementation Method 2
supplying a dry fluid from a dry fluid nozzle positioned above the center of the substrate onto the substrate for a predetermined time while rotating the substrate at a third speed after rotating the substrate at the second speed
Data Source
AI summary
The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus (1) includes a controller (90). The controller (90) rotates the substrate (W) at a second speed, after rotating the substrate (W) at a first speed. The controller (90) supplies a dry fluid from a dry fluid nozzle (30) onto the substrate (W) for predetermined time after rotating the substrate (W) at the second speed, and while rotating the substrate (W) at a third speed. The controller (90) moves a dry fluid nozzle (30) from a center of the substrate (W) toward a peripheral portion of the substrate (W) while continuing to supply the dry fluid from the dry fluid nozzle (30).