Substrate Drying Flow Layout to Prevent Air Pocket Defects
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Solution Overview
Problem
The rotary drying process for substrates can damage patterns and fail to adequately remove cleaning fluids from high-aspect-ratio features due to rotation, and supercritical drying processes may introduce air pockets that cause defects.
Innovation Solution
A substrate processing apparatus and method that includes a body with a processing space, a first fluid supply line, a second fluid supply line, and an air removal line to manage air pockets by connecting the air removal line to the first fluid supply line near the supply valve and the exhaust line, allowing air to be removed or circulated, minimizing the transfer of air pockets to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a rotary drying process is used to remove residual cleaning solution, then drying efficiency is improved, but patterns on the substrate may be destroyed and cleaning fluid may not be adequately removed from high-aspect-ratio features
Solution Approach 1:
The patent replaces the mechanical rotary drying system with a chemical/physical field-based supercritical drying system. Supercritical carbon dioxide is used as a drying agent that can penetrate high-aspect-ratio features and remove cleaning fluids without the mechanical forces that damage patterns. The supercritical fluid provides gentle solvation and extraction without rotational mechanical stress.
Solution Approach 2:
The patent changes the physical parameters of the drying agent by using supercritical carbon dioxide instead of conventional gases or liquids. By controlling temperature and pressure to achieve the supercritical state, the drying agent gains enhanced solubility and permeability properties that allow it to effectively remove cleaning fluids from complex substrate features without causing damage.
2Temperature
If drying gas is supplied from the lower supply line to pressurize the processing space, then supercritical state is achieved, but air pockets are formed and transferred to the substrate causing defects
Solution Approach 1:
The patent applies preliminary action by first supplying drying gas from the upper supply line to pressurize and displace air from the processing space before the main supercritical drying process. This preliminary gas supply from above prevents air from being trapped and carried to the substrate, eliminating the formation of harmful air pockets while still achieving the necessary pressure for supercritical state.
Solution Approach 2:
The patent inverts the conventional gas supply approach by supplying drying gas from the upper supply line instead of the lower supply line. This reversal of the gas flow direction prevents air from being pushed toward the substrate and instead forces air to escape through the exhaust system, thereby preventing air pocket formation and transfer to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances drying treatment efficiency and minimizes air pocket transfer to the substrate, reducing defects and ensuring effective removal of residual cleaning fluids without damaging the substrate patterns.
Implementation Method 1
the drying gas easily penetrates into the patterns on the substrate, and the organic solvent remaining on the substrate is also easily dissolved in the drying gas
Implementation Method 2
a supercritical drying process has been utilized in which the residual cleaning solution on the substrate is replaced with an organic solvent, such as isopropyl alcohol (IPA), which has a low surface tension
Data Source
AI summary
Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a first fluid supply line connected to the body and supplying treatment fluid to the processing space; a second fluid supply line connected to the body at a location different from the first fluid supply line and supplying treatment fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line having one end connected to the first fluid supply line in a lower stream than the first supply valve to allow air in the processing space that is introduced into the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies treatment fluid to the processing space.