Substrate Drying Uniformity via Center-to-Periphery Liquid Dispensing
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Solution Overview
Problem
Existing substrate treating processes face challenges in uniformly drying treatment liquids on substrates during cleaning, leading to residual contaminants and particles, which can affect the yield and quality of semiconductor and display devices.
Innovation Solution
A substrate treating apparatus and method that involves a controlled supply and drying of treatment liquids using a jetting module, where the liquid is dispensed from the center of the substrate to the periphery, combined with rotational drying and the use of heat, inert gases, or vacuum pressure to ensure uniform evaporation and removal of the treatment liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If treatment liquid is supplied to the substrate during cleaning, then cleaning effectiveness is improved, but non-uniform drying occurs with peripheral liquid drying faster than center liquid
Solution Approach 1:
The patent applies local quality by making the drying conditions spatially non-uniform to compensate for the natural drying pattern. Specifically, the heating element is positioned to provide stronger heat to the center region where liquid remains longer, while the peripheral regions receive less heat as they dry faster naturally. This localized adjustment of thermal energy distribution achieves uniform overall drying across the substrate surface.
2Device complexity
If conventional drying methods are used, then process simplicity is maintained, but residual contaminants and particles remain on the substrate
Solution Approach 1:
The patent changes the thermal parameter distribution across the substrate by positioning the heating element to create a non-uniform temperature profile. The heating element is placed at a specific distance from the substrate and configured to concentrate thermal energy on the center region, thereby altering the drying kinetics to match the liquid distribution pattern and achieve complete drying without residues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures more uniform drying of treatment liquids, improving the removal efficiency and increasing the yield of substrates by extending the drying time for the center liquid while preventing excessive drying of the peripheral liquid, thus enhancing the cleaning process.
Implementation Method 1
a heating element positioned to overlap a center region of the substrate in a third direction DR3
Implementation Method 2
the liquid is dispensed from the center of the substrate to the periphery, combined with rotational drying and the use of heat, inert gases, or vacuum pressure to ensure uniform evaporation and removal of the treatment liquid
Data Source
AI summary
There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.