Substrate Drying via Centrifugal Force and Gas Discharge
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Solution Overview
Problem
Conventional substrate processing apparatuses face operational troubles and processing defects due to liquid adherence during the liquid immersion exposure method, leading to contamination and film defects on substrates.
Innovation Solution
A substrate processing apparatus with a drying processing unit that includes a substrate holding device, rotation driving device, liquid layer formation device, and gas discharge device, which forms a liquid layer on the substrate and uses centrifugal force and gas discharge to remove the liquid, preventing it from adhering and causing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If liquid immersion exposure method is used to achieve finer exposure patterns, then manufacturing precision is improved, but operational reliability deteriorates due to liquid adhesion causing contamination and equipment abnormalities
Solution Approach 1:
The drying processing unit performs drying treatment on the substrate before it is transferred from the exposure device. This preliminary action removes liquid from the substrate surface in advance, preventing liquid adhesion problems during subsequent handling and processing steps, thereby maintaining operational reliability while preserving the benefits of liquid immersion exposure
2Manufacturing precision
If liquid immersion exposure method is used to achieve finer exposure patterns, then manufacturing precision is improved, but processing quality deteriorates due to particles and liquid affecting the film on substrate
Solution Approach 1:
The drying processing unit removes liquid from the substrate surface before transfer, creating a preliminary protective state. This prevents subsequent particle adhesion and liquid-related film defects, thereby eliminating harmful factors while maintaining the fine exposure pattern capability
Solution Approach 2:
The invention converts the potentially harmful liquid residue into a controlled drying process. By intentionally applying drying treatment with gas discharge and centrifugal force, the system transforms the liquid adhesion problem into a controlled removal process, eliminating contamination risks while preserving the benefits of liquid immersion exposure
3Productivity
If substrate is carried out of exposure device with liquid adhesion, then exposure processing is completed, but operational troubles occur such as electric system abnormalities
Solution Approach 1:
The drying processing unit performs drying treatment immediately after exposure processing and before the substrate leaves the exposure device. This preliminary action ensures liquid is removed in advance, preventing operational troubles such as electric system abnormalities during substrate handling and transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents liquid from dropping and causing contamination, ensuring reliable removal and maintaining substrate quality by preventing liquid from adhering and particles from affecting the film, thus reducing operational issues and defects.
Implementation Method 1
a rotation driving device that rotates the substrate held by the substrate holding device around an axis perpendicular to the substrate
Implementation Method 2
a gas discharge device that discharges gas toward the center of the liquid layer formed on the substrate by the liquid layer formation device with the substrate rotated by the rotation driving device
Data Source
AI summary
A substrate processing method comprises the step of subjecting a substrate to drying processing in at least one of a processing section and an interface, wherein the step of subjecting the substrate to the drying processing comprises the steps of: rotating the substrate at a first rotational speed around an axis perpendicular to the substrate, while holding the substrate horizontally, forming a liquid layer on the substrate in a state where the substrate is rotated at the first rotational speed, gradually and continuously increasing the rotational speed of the substrate to a second rotational speed after the formation of the liquid layer, and starting discharging a gas to the liquid layer on the substrate while the substrate is rotated at the second rotational speed.