Sealed Substrate Drying Chamber with Direct Injection Nozzle
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Solution Overview
Problem
Conventional substrate cleaning and drying apparatuses face challenges in fully removing DI water from larger-diameter wafers with finer patterns, leading to poor drying due to external environmental influences and inefficient fume drainage, resulting in substrate contamination.
Innovation Solution
A substrate treating apparatus with a substrate support unit, a bottom chamber, and a top chamber that can be sealed to isolate the substrate from the outside environment, using a direct injection nozzle to inject drying fluid directly onto the substrate while the bottom chamber is sealed, enhancing drying efficiency and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If DI water is supplied to clean the substrate surface, then cleaning effectiveness is improved, but residual water remains on the substrate causing poor drying
Solution Approach 1:
The patent uses nitrogen gas to create an inert atmosphere environment for substrate drying. The nitrogen gas replaces air and prevents water re-condensation on the substrate surface, ensuring complete drying without contamination from external environment.
Solution Approach 2:
The patent extracts and removes residual DI water from the substrate surface using nitrogen gas flow. The nitrogen gas carries away the water molecules through evaporation and flow, separating the drying function from the cleaning function.
2Productivity
If the substrate is dried while exposed to air, then drying can be performed, but external environment causes contamination and poor drying
Solution Approach 1:
The patent creates a sealed chamber filled with nitrogen gas to provide an inert atmosphere during substrate drying. This prevents external environmental contamination while maintaining controlled drying conditions, solving both drying speed and contamination issues.
Solution Approach 2:
The patent uses a sealed chamber structure to isolate the substrate from the external environment. The chamber acts as a barrier that maintains the inert nitrogen atmosphere while allowing controlled introduction and removal of substrates.
3Object-generated harmful factors
If exhaust structure is formed at the bottom of chamber, then some fume drainage is achieved, but fumes are not drained smoothly causing substrate contamination
Solution Approach 1:
The patent inverts the conventional exhaust approach by introducing nitrogen gas from the top and allowing fumes to naturally rise and exit through the gas flow direction, rather than trying to pull fumes from the bottom. This creates smooth fume drainage that prevents contamination.
Solution Approach 2:
The patent replaces the mechanical exhaust system with a gas flow-based system. Nitrogen gas flow carries away fumes through evaporation and convection, substituting mechanical suction with a more effective gas dynamic approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures fast and efficient drying of substrates by maintaining a controlled environment, minimizing external influences, and effectively removing residual water and particles, while preventing contamination from fumes and foreign substances.
Implementation Method 1
injecting drying fluid to the substrate to dry the substrate
Implementation Method 2
a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while being isolated from the outside
Data Source
AI summary
A substrate treating apparatus includes a substrate support unit with a chuck on which a substrate is loaded; a bottom chamber having an open top and configured to surround the circumference of the chuck; a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while the top chamber is sealed from the outside; and a direct injection nozzle member installed at the top chamber to inject fluid directly to the substrate while the top of the bottom chamber is closed. According to the substrate treating apparatus, drying efficiency of an entire substrate is enhanced, external contaminants are blocked, and generation of an oxide layer is suppressed.