Supercritical Substrate Drying Flow Path for Edge Turbulence Control
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Solution Overview
Problem
In semiconductor manufacturing, the use of supercritical fluids for drying substrates can cause turbulent flow near the edge of the substrate, leading to pattern collapse due to shear stress as the fluid reaches the top of the substrate.
Innovation Solution
A substrate treating apparatus with a throat structure in the fluid flow path that narrows and widens the cross-sectional size, minimizing turbulent flow and reducing shear stress, using a shielding plate and movable components to support the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If supercritical fluid is supplied to the substrate treating space, then the substrate drying function is improved, but turbulent flow occurs near the edge of the substrate causing pattern collapse
Solution Approach 1:
A shielding plate is introduced as an intermediary component between the supercritical fluid supply and the substrate. The shielding plate redirects the fluid flow path to avoid direct impingement on the substrate edge, thereby preventing turbulent flow and shear stress while maintaining effective substrate drying
Solution Approach 2:
The fluid flow path is redirected from a direct vertical path to a bypass path that flows along the side of the shielding plate before reaching the substrate. This dimensional redirection of fluid flow eliminates direct contact with the substrate edge while still achieving substrate drying through controlled fluid exposure
2Object-affected harmful factors
If a shielding plate is added to control fluid flow, then pattern collapse is prevented, but device complexity increases
Solution Approach 1:
The shielding plate serves multiple functions simultaneously: it acts as a flow redirector to prevent turbulent flow, provides structural support for the substrate, and defines the treating space geometry. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents pattern collapse by controlling turbulent flow and reducing shear stress at the edge of the substrate during supercritical drying, ensuring the integrity of semiconductor patterns.
Implementation Method 1
turbulent flow may occur near an edge of the substrate, causing the pattern to experience shear stress
Implementation Method 2
a drying process that uses a supercritical fluid
Data Source
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AI summary
A substrate treating apparatus to minimize the occurrence of turbulent flow in the edge direction of the substrate and semiconductor manufacturing equipment including the substrate treating apparatus are provided. The substrate treating apparatus includes an upper module including a first supply port providing supercritical fluid to a substrate treating space, a lower module coupled to the upper module and including a second supply port providing the supercritical fluid to the substrate treating space, a shielding plate disposed in the substrate treating space, a plate support coupled to the lower module and supporting the shielding plate, and a first substrate support coupled to the shielding plate and supporting the substrate. A fluid flow path between the lower module and the shielding plate includes a throat structure changing a cross-sectional size of the fluid flow path.