Substrate Drying Exhaust Lines for Controlled and Rapid Discharge
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Solution Overview
Problem
The miniaturization of semiconductor patterns leads to a leaning phenomenon during spin drying, causing pattern collapse or bending, which existing technologies fail to adequately address, especially with the introduction of supercritical drying methods that require longer process times.
Innovation Solution
A substrate treating apparatus with a vessel part, fluid supply, and exhaust units that include a main line, extension line, and auxiliary line, where the exhaust fluid is controlled through orifices and check valves to manage exhaust speed and pressure, allowing for faster process completion by varying the discharge paths during different process times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single exhaust line with orifices and check valves is used to control exhaust speed, then the supercritical fluid can be exhausted at a controlled speed during the first process time, but the exhaust speed becomes too slow during the second process time, extending the overall process time
Solution Approach 1:
The exhaust line is divided into a first exhaust line with orifices and check valves for controlled exhaust during the first process time, and a second exhaust line without orifices for rapid exhaust during the second process time. This segmentation allows different exhaust speeds to be used at different stages of the drying process, resolving the contradiction between controlled exhaust speed and reduced process time.
Solution Approach 2:
The system dynamically switches between the first exhaust line and the second exhaust line based on the drying process stage. The switching mechanism allows the exhaust configuration to change from a controlled-speed mode to a rapid-exhaust mode, adapting to the different requirements at different process times and thereby reducing overall process time while maintaining reliability.
2Loss of time
If the exhaust speed is increased to reduce process time, then the process time is reduced, but the supercritical fluid cannot be exhausted at a sufficiently controlled speed, affecting drying quality
Solution Approach 1:
The exhaust system is segmented into two distinct pathways: the first exhaust line with flow-controlling components (orifices and check valves) for controlled exhaust, and the second exhaust line without such components for rapid exhaust. This segmentation enables the system to achieve both controlled and rapid exhaust capabilities, resolving the contradiction between exhaust speed control and process time reduction.
Solution Approach 2:
The system changes the exhaust parameters by switching between different exhaust lines with different flow resistance characteristics. The first exhaust line provides high flow resistance for controlled exhaust, while the second exhaust line provides low flow resistance for rapid exhaust. This parameter change allows the system to optimize exhaust speed according to process requirements, reducing process time while maintaining drying quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This apparatus reduces the process time for supercritical drying by optimizing fluid exhaust speeds and pressures, preventing pattern distortion and enhancing the efficiency of the drying process.
Implementation Method 1
an orifice and a check valve are not formed, wherein, during a first process time, the treating fluid is discharged through the extension line
Implementation Method 2
including at least one of a first orifice or a first check valve to control an exhaust speed
Implementation Method 3
a spin chuck configured to support the substrate is rotated, and spin drying is performed to dry the developer or the rinsing liquid remaining on the substrate using a centrifugal force applied by the spin chuck to the substrate
Implementation Method 4
a substrate treating apparatus which can reduce the process time... treats a substrate by moving a supercritical fluid into and out of the sealed space
Data Source
AI summary
According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.