Substrate Drying Unit Adjacent to Exposure Tool
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing apparatuses face operational troubles due to liquid adherence on substrates during exposure processing, leading to potential oxidation and contamination, which can result in processing defects and reduced yield.
Innovation Solution
A substrate processing apparatus is designed with a drying processing unit adjacent to the exposure device, ensuring that substrates are dried immediately after exposure, minimizing post-exposure delay and preventing liquid from dropping and causing operational issues. This apparatus also includes a thermal processing unit for early thermal processing and a hydrophobic processing unit to prevent liquid from soaking into the film, along with a temperature control waiting unit to maintain substrate temperature and reduce transport steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If liquid immersion method is used for exposure processing to achieve finer patterns, then manufacturing precision is improved, but liquid adhering to substrate causes operational troubles and reduces reliability
Solution Approach 1:
The drying processing unit is positioned adjacent to the exposure device to perform drying processing immediately after exposure processing, before the substrate is transported out. This preliminary action removes liquid from the substrate surface while it is still in the controlled environment, preventing liquid adherence issues during transport and subsequent operations.
Solution Approach 2:
The drying processing unit extracts and removes the liquid from the substrate surface after exposure processing. By extracting the harmful liquid element immediately after the beneficial liquid immersion exposure, the system maintains the precision benefits while eliminating the operational reliability problems caused by liquid adherence.
2Productivity
If substrate is transported from exposure device with liquid adhering, then processing continuity is maintained, but liquid drops cause operational troubles
Solution Approach 1:
Drying processing is performed as a preliminary action immediately after exposure processing, before the substrate leaves the exposure device environment. This ensures the substrate is dry when transported, eliminating the risk of liquid drops during transport while maintaining processing continuity through the adjacent positioning of the drying unit.
3Loss of time
If thermal processing is delayed after exposure, then transport time is reduced, but oxidation and contamination increase
Solution Approach 1:
The drying processing unit performs drying as a preliminary action immediately after exposure, creating a liquid-free surface condition. This preliminary drying prevents oxidation and contamination by removing the liquid medium that would otherwise facilitate these harmful processes during any subsequent transport or waiting period.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents liquid-related operational troubles, minimizes post-exposure delay, reduces oxidation, and enhances processing reliability by ensuring thorough drying and early thermal processing, thereby improving substrate quality and reducing defects.
Implementation Method 1
a drying processing unit that is provided adjacent to the interface for applying drying processing to the substrate
Implementation Method 2
a thermal processing unit that applies thermal processing to the substrate
Implementation Method 3
a hydrophobic processing unit to prevent liquid from soaking into the film
Data Source
AI summary
The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.