Substrate Drying Film for Fine Pattern Collapse Prevention
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Solution Overview
Problem
Conventional substrate treating methods fail to adequately protect fine patterns on substrates, leading to potential collapse during treatment due to insufficient support and volume changes of solidified films.
Innovation Solution
A substrate treating method involving the application of a dry assistant liquid containing a thermosetting or ultraviolet curable material, followed by curing and thermal decomposition, where the solidified film is formed above the pattern projections and not in the recesses, providing support and preventing collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate treating method is used, then the substrate can be dried, but the pattern may collapse due to insufficient support
Solution Approach 1:
A dry assistant liquid is introduced as an intermediary substance between the solvent and the pattern. This liquid forms a solidified film that acts as a temporary support structure during drying, preventing pattern collapse. The dry assistant liquid contains a curable resin that solidifies to provide mechanical support, then is removed after serving its protective function.
Solution Approach 2:
The dry assistant liquid is applied to the substrate before the drying process begins. The liquid penetrates into the pattern structure in advance, and the curable resin within it solidifies to form a support film prior to solvent removal. This preliminary action ensures the pattern is protected before the harmful drying process occurs.
2Strength
If the solidified film is formed throughout the pattern including recesses, then support is provided, but the pattern is affected by volume change of the solidified film
Solution Approach 1:
The dry assistant liquid is designed to selectively solidify only in specific regions - above the pattern projections - while deliberately avoiding the recesses. This local quality approach provides support exactly where needed (on the projections) without introducing harmful volume changes in the recess areas, thus maintaining pattern dimensional accuracy.
Solution Approach 2:
The solidified film of the dry assistant liquid creates a positive replica or copy of the pattern projections, forming a support structure that mirrors the projection geometry. This copied structure provides support without requiring the liquid to penetrate into the recesses, avoiding volume change issues in those regions.
3Manufacturing precision
If the pattern is fine, then higher precision is achieved, but the collapse resistance is insufficient
Solution Approach 1:
The dry assistant liquid forms a thin film structure that conforms to the fine pattern geometry. This thin film provides distributed support across the entire pattern surface, including delicate fine features. The film's flexibility allows it to adapt to fine pattern dimensions while still providing sufficient mechanical support to prevent collapse during drying.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively protects the substrate pattern by supporting projections while allowing for drying without collapsing, even with fine recesses, ensuring a clean and intact substrate surface post-treatment.
Implementation Method 1
a first application step of applying a first dry assistant liquid containing a thermosetting material and a solvent to the substrate; a first curing step of heating the first dry assistant liquid on the substrate to form a first solidified film on the substrate
Implementation Method 2
a first thermal decomposition step of heating the first solidified film to thermally decompose the first solidified film and drying the substrate
Data Source
AI summary
The substrate treating method is to treat a substrate W on which a pattern P is formed. The pattern P includes a plurality of projections A and a plurality of recesses B. The substrate treating method includes a first application step, a first curing step, and a first thermal decomposition step. In the first application step, a first dry assistant liquid F1 is applied to the substrate W. The first dry assistant liquid F1 contains a thermosetting material and a solvent. In the first curing step, the first dry assistant liquid F1 on the substrate W is heated. In the first curing step, a first solidified film H1 is formed on the substrate W. In the first thermal decomposition step, the first solidified film H1 is heated and thus the first solidified film H1 is thermally decomposed. In the first thermal decomposition step, the substrate W is dried.