Substrate Drying via Gas Layer Formation
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Solution Overview
Problem
The miniaturization of semiconductors leads to pattern collapse during the drying process due to surface tension of volatile solvents, particularly when nonuniform drying rates result in residual liquids between patterns, causing elastic deformation and adhesion of fallen patterns.
Innovation Solution
A substrate processing apparatus and method involving a solvent supply unit for volatile solvents and a heater to form a gas layer on the substrate surface, converting the solvent into liquid balls, thereby promoting uniform drying and preventing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a volatile solvent such as IPA is used to dry the substrate surface, then the surface tension is reduced compared to ultrapure water, but pattern collapse still occurs due to nonuniform drying rate and residual liquid between patterns
Solution Approach 1:
The patent changes the physical state parameter of the solvent from liquid to gas by rapid heating. The substrate is heated to a temperature of 100°C or higher, causing the volatile solvent to evaporate instantly and form a gas layer, which prevents the liquid from remaining between patterns and causes pattern collapse
Solution Approach 2:
The patent utilizes the phase transition of the volatile solvent from liquid to gas through rapid evaporation. By heating the substrate to 100°C or higher, the solvent rapidly changes phase, forming a gas layer that prevents capillary action and eliminates residual liquid between patterns, thereby preventing pattern collapse
2Manufacturing precision
If the substrate is heated to form a gas layer and convert the solvent into a liquid ball, then pattern collapse is suppressed, but the process requires precise temperature control and rapid heating
Solution Approach 1:
The patent applies preliminary action by pre-heating the substrate to a temperature of 100°C or higher before the solvent is supplied. This preliminary heating ensures that when the volatile solvent contacts the hot substrate surface, it instantly evaporates and forms a gas layer, preventing pattern collapse without requiring complex real-time temperature control during the drying process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables successful drying of substrates while suppressing pattern collapse by instantaneously vaporizing solvents between patterns, ensuring a uniform drying rate and preventing residual solvent-induced deformation.
Implementation Method 1
heating the substrate such that a gas layer is formed on the surface of the substrate, which has been supplied with the volatile solvent
Implementation Method 2
heating the substrate such that a gas layer is formed on the surface of the substrate, which has been supplied with the volatile solvent, to make the volatile solvent into a liquid ball
Data Source
AI summary
According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.