Substrate Drying Fluid Line Discharge for Contamination Control
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Solution Overview
Problem
The generation of defects during the substrate drying process in semiconductor manufacturing is a challenge due to the presence of foreign substances like particles and metal impurities, which can affect the performance and yield of semiconductor devices.
Innovation Solution
A substrate processing apparatus is designed with a drying housing, a process fluid supply, a supply fluid line, a pressure reducing fluid line, and a controller that controls the operation to manage the pressure and discharge of process fluid, preventing defects by stopping fluid supply and discharging residual fluid through the pressure reducing line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If process fluid is continuously supplied to the drying housing during the drying process, then the drying efficiency is maintained, but foreign substances may enter through the supply fluid line and cause defects on the substrate
Solution Approach 1:
The invention extracts and removes the process fluid from the supply fluid line through a discharge path before it can enter the drying housing. This is achieved by providing a discharge valve and discharge path that enable removal of fluid remaining in the supply fluid line, preventing foreign substances trapped in the line from contaminating the substrate during drying.
Solution Approach 2:
The invention performs a preliminary discharge action before the drying process begins or before fluid supply is interrupted. The controller is configured to operate the discharge valve to remove process fluid from the supply fluid line in advance, ensuring that foreign substances do not enter the drying housing when the main valve is closed or when supply is stopped.
2Object-affected harmful factors
If the supply of process fluid is stopped to prevent foreign substance contamination, then defect generation is reduced, but the drying process efficiency decreases
Solution Approach 1:
The invention introduces a discharge valve and discharge path as intermediary components between the supply fluid line and the drying housing. This intermediary system allows for selective removal of process fluid from the supply line without interrupting the main drying process, thus preventing contamination while maintaining drying efficiency.
Solution Approach 2:
The invention changes the operational parameters of the fluid system by independently controlling the discharge valve separate from the main supply valve. This allows for brief fluid discharge operations without stopping the overall drying process, maintaining productivity while preventing foreign substance entry.
3Object-affected harmful factors
If a pressure reducing valve is added to discharge process fluid from the supply fluid line, then foreign substance contamination is prevented, but the device complexity increases
Solution Approach 1:
The discharge valve and discharge path are designed to serve multiple functions: they can discharge process fluid from the supply line, maintain system pressure balance, and work in coordination with the main supply valve to control fluid flow. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces the generation of defects during the drying process by maintaining efficient fluid flow and pressure management, enhancing the quality and yield of semiconductor devices.
Implementation Method 1
cause the process fluid remaining in the supply fluid line to discharge through the pressure reducing fluid line
Data Source
AI summary
A substrate processing apparatus may include a drying housing having an internal space for performing a drying process, a process fluid supply configured to receive a process fluid used in the drying process, a supply fluid line connected to the drying housing and the process fluid supply, a pressure reducing fluid line connected to the supply fluid line, and a controller configured to control the operation of the substrate processing apparatus. The controller is configured to cause the supply of the process fluid to the drying housing through the supply fluid line to stop and discharge the process fluid remaining in the supply fluid line through the pressure reducing fluid line.