Substrate Drying Nozzle Layout for Stable Liquid Film Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently drying substrates while minimizing particle generation and preventing liquid film collapse, particularly due to limitations in nozzle design and fluid distribution mechanisms.
Innovation Solution
A substrate processing apparatus featuring a holder for horizontal substrate rotation, a nozzle system with intersecting discharge lines for the first and second nozzle members, and a moving unit that adjusts the collision angle of the fluid to suppress spattering, allowing independent control of fluid flow rates and nozzle positions to manage the drying process effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle discharges fluid onto the substrate, then the device structure is simple, but the fluid distribution uniformity and drying efficiency are insufficient
Solution Approach 1:
The single nozzle is divided into multiple nozzle members (first nozzle member and second nozzle member) with different discharge directions. The first nozzle member discharges fluid in a first direction while the second nozzle member discharges fluid in a second direction, creating intersecting discharge lines that improve fluid distribution uniformity across the substrate surface without requiring complex multi-nozzle arrays
2Productivity
If the nozzle remains stationary during substrate rotation, then the device structure is simple, but the drying efficiency and liquid film control are insufficient
Solution Approach 1:
The nozzle is made movable in the diametrical direction of the substrate through a moving unit, allowing dynamic adjustment of the nozzle position during substrate rotation. This enables the discharge lines to intersect at different positions on the substrate, improving drying efficiency and liquid film control while maintaining relatively simple device structure
3Stability of the object's composition
If the fluid is discharged at a fixed angle, then the nozzle structure is simple, but the liquid film stability and particle generation control are insufficient
Solution Approach 1:
Different nozzle members are configured with different discharge angles and directions tailored to specific local requirements. The first nozzle member discharges at a first angle suitable for initial fluid distribution, while the second nozzle member discharges at a second angle optimized for liquid film stabilization and particle generation control, allowing localized optimization without complex adjustable mechanisms
4Manufacturing precision
If the flow rate of the fluid is not independently controlled, then the supply system is simple, but the drying precision and liquid film thickness control are insufficient
Solution Approach 1:
The fluid supply system is segmented into multiple independent flow rate controllers, each associated with specific nozzle members. This allows independent control of discharge amounts for the first and second nozzle members, enabling precise control of liquid film thickness and drying precision while maintaining relatively simple control architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient substrate drying by minimizing particle generation and preventing liquid film collapse, ensuring uniform fluid distribution and effective removal of liquids while maintaining substrate integrity.
Implementation Method 1
a substrate processing apparatus described in Patent Document 1 forms a liquid film of IPA (IsoPropyl Alcohol) on a top surface of a substrate being rotated
Implementation Method 2
the substrate processing apparatus jets a N2 gas to the opening of the liquid film of the IPA, thus allowing the edge of the opening to be pressed by the N2 gas
Implementation Method 3
an edge of the opening is then expanded from the center of the substrate W toward the periphery thereof, so that the substrate W is dried
Data Source
AI summary
A substrate processing apparatus includes a holder configured to hold a substrate horizontally; a substrate rotating unit configured to rotate the holder; a nozzle configured to supply a fluid onto a top surface of the substrate; a supply unit configured to supply the fluid to the nozzle; and a moving unit configured to move the nozzle in a diametrical direction of the substrate. The nozzle includes a first nozzle member configured to discharge the fluid and a second nozzle member configured to discharge the fluid in a direction different from a direction in which the first nozzle member discharges the fluid. Discharge lines of the first and the second nozzle members intersect with each other at an intersection point. The supply unit includes a first and a second flow rate controllers configured to respectively control discharge amounts of the first and the second nozzle members independently.