Substrate Drying Method Preventing Rear Surface Stains

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Solution Overview

Problem

Conventional substrate drying processes can cause pattern collapse and stains on the rear surface of substrates due to surface tension and the flow of water-repellent agents, which contaminates the apparatus and affects the quality of the substrate.

Innovation Solution

A substrate processing method involving a series of steps including surface cleaning, water removal, water-repellency, and drying, where a gas is supplied to the rear surface and an organic solvent is used to substitute the water-repellent agent on the front surface, preventing the exposure of the front surface to air and reducing the risk of pattern collapse and stains.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a water-repellent agent is supplied to the front surface of the substrate, then pattern collapse is suppressed, but stains are generated on the rear surface of the substrate

Engineering Contradiction:
Improvepattern integrityVSAvoidstains on rear surface
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies preliminary action by removing water from the rear surface of the substrate before supplying the water-repellent agent to the front surface. This preventive measure ensures that no water remains on the rear surface to react with the water-repellent agent, thereby preventing stain formation while still allowing the front surface treatment to prevent pattern collapse

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the substrate treatment process into distinct front surface and rear surface handling. The front surface receives the water-repellent agent treatment while the rear surface undergoes separate water removal treatment. This segmentation allows independent optimization of each surface treatment to achieve both pattern protection and stain prevention

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the front surface is exposed to outside air during water removal, then water can be removed from the rear surface, but pattern collapse occurs due to surface tension

Engineering Contradiction:
Improvewater removalVSAvoidpattern integrity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent introduces a processing liquid as an intermediary substance to replace water on the front surface before water removal. This processing liquid has different surface tension characteristics that prevent pattern collapse. The intermediary liquid allows water to be removed from the rear surface through the substrate while maintaining pattern integrity on the front surface

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If conventional drying processing is applied, then water is removed from the substrate, but pattern collapse occurs due to surface tension of processing liquid

Engineering Contradiction:
Improvewater removalVSAvoidpattern integrity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent changes the physical-chemical parameters of the liquid environment by introducing a processing liquid with different surface tension properties compared to conventional water-based processing liquids. This parameter change allows effective water removal during drying while the modified surface tension prevents the processing liquid from causing pattern collapse on the substrate

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively prevents pattern collapse and stains on the rear surface of substrates, ensuring a clean and contaminant-free processing environment while maintaining the water-repellency on the front surface.

Implementation Method 1

a pattern collapse may occur by the surface tension of the processing liquid acting on the pattern formed on a front surface of the substrate

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 2

a substitution step of supplying an organic solvent to the first surface of the substrate to substitute the water on the first surface with the organic solvent

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS10366877B2Substrate processing method and substrate processing apparatus
Publication Date: 2019.07.30 TOKYO ELECTRON LTD
  • US10366877B2 patent drawing
  • US10366877B2 patent drawing
  • US10366877B2 patent drawing

AI summary

Disclosed is a substrate processing method including a first surface cleaning step of supplying a first cleaning liquid containing water to a first surface of a substrate; a second surface cleaning step of supplying a second cleaning liquid containing water to a second surface that is opposite to the first surface; a water removal step of removing the water remaining on the second surface of the substrate in a state where the first surface is not exposed to outside air, after the second surface cleaning step; a water-repellency step of supplying a water-repellent agent to the first surface of the substrate after the water removal step; and a drying step of drying the substrate after the water-repellency step.