Substrate Drying with Segmented Heating and Vacuum Suction
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Solution Overview
Problem
In the process of manufacturing semiconductor devices and flat panel display panels, the drying of rinsing liquids on substrates often results in pattern collapse due to non-uniform rotational speeds and inadequate drying techniques, leading to incomplete drying and defects.
Innovation Solution
A substrate treating apparatus with a substrate support unit, liquid supply unit, and heating unit that includes a suction mechanism, multiple heating members, and a controller to manage rotational speeds and heating intervals, ensuring uniform drying by sequentially supplying treatment, rinsing, and drying liquids while adjusting heating and rotational speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is rotated at high speed during drying operation, then the liquid can be removed more quickly, but the rotational speeds become non-uniform across different areas causing non-uniform drying
Solution Approach 1:
The heating unit is divided into multiple heating members (first heating member and second heating member) that independently heat different regions of the substrate. This segmentation allows each heating member to operate at optimized temperatures for its specific region, compensating for the non-uniform rotational speeds and achieving uniform drying across the entire substrate surface.
Solution Approach 2:
Different regions of the substrate receive different heating conditions through the first and second heating members. The first heating member heats one region while the second heating member heats another region, allowing local optimization of drying conditions to compensate for variations in rotational speed across different areas of the substrate.
2Device complexity
If conventional drying methods are used, then the process is simple, but pattern collapse occurs due to inadequate drying techniques
Solution Approach 1:
The drying process utilizes controlled changes in temperature parameters through multiple heating members to achieve effective drying. By adjusting the temperature and heating duration parameters in a controlled manner, the method prevents pattern collapse while removing liquid, improving reliability without requiring complex additional equipment.
Solution Approach 2:
The drying system employs a composite approach combining multiple heating members with different heating characteristics. This composite heating system provides multi-dimensional thermal control that effectively prevents pattern collapse while maintaining process simplicity, achieving high reliability through the synergistic combination of heating elements.
3Device complexity
If a single heating source is used, then the device structure is simple, but uniform heating of different substrate areas cannot be achieved
Solution Approach 1:
The heating system is segmented into multiple heating members positioned to heat different regions of the substrate. This segmentation enables each heating member to independently control the temperature of its designated region, achieving uniform heating across the entire substrate surface despite the increased number of components.
Solution Approach 2:
The heating approach transitions from a single-point or single-plane heat source to a multi-dimensional heating configuration with heating members positioned at different locations and orientations. This dimensional expansion of the heating system enables comprehensive and uniform heating coverage across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus stabilizes and uniformly dries substrates, reducing pattern collapse and enhancing drying efficiency by controlling rotational speeds and targeted heating of substrate areas.
Implementation Method 1
a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate
Implementation Method 2
a heating unit configured to heat the substrate supported by the substrate support unit
Implementation Method 3
a drying operation of removing the rinsing liquid residing on the substrate
Data Source
AI summary
Embodiments of the inventive concept relate to an apparatus and a method for removing a liquid residing on a substrate. The substrate treating apparatus includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply a liquid onto the substrate supported by the substrate support unit, and a heating unit configured to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes a support plate having a seating surface, on which the substrate is seated, and having a suction hole on the seating surface, a rotary shaft configured to rotate the support plate, and a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate. Accordingly, the drying efficiency of the substrate may be increased.