Substrate Drying via Shear Force to Prevent Pattern Collapse
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sublimation drying methods for substrates result in pattern collapse due to uneven film formation caused by the low viscosity and film formability issues of sublimation materials, leading to deformation of surface patterns.
Innovation Solution
A substrate processing method that involves applying a sublimation material dissolved in a volatile solvent, changing the rotation acceleration to apply a shear force and eliminate association states, thereby reducing film formation unevenness and preventing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sublimation drying is used with low viscosity sublimation material, then drying capability is achieved, but film formation unevenness occurs causing pattern collapse
Solution Approach 1:
The invention changes the physical-chemical parameters of the sublimation material by selecting specific compounds with appropriate molecular weight ranges (100-300) and controlling solution concentration (1-10 wt%), transforming the material properties to achieve both good film formation and sublimation drying performance
Solution Approach 2:
The invention applies different properties to different aspects of the sublimation material: the molecular weight and chemical structure are optimized for film formation uniformity, while the sublimation point and volatility are optimized for drying capability, achieving local optimization of material properties
2Reliability
If low molecular organic material is used as sublimation material, then sublimation drying function is achieved, but film formability deteriorates due to low viscosity
Solution Approach 1:
The invention optimizes the molecular weight parameter to a specific range (100-300) and controls the solution concentration (1-10 wt%), transforming the material from having poor film formability to achieving uniform film deposition while maintaining sublimation drying function
Solution Approach 2:
The invention creates a composite system by dissolving the sublimation material in a specific solvent to form a solution with optimized viscosity and film-forming properties, combining the advantages of both the sublimation material and the solvent
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses film formation unevenness and pattern deformation by eliminating association states of the sublimation material, ensuring a smoother and more uniform film deposition during the drying process.
Implementation Method 1
The precipitated sublimation material is changed from a solid phase to a gas phase (sublimation), so that the sublimation material is removed from the surface of the substrate.
Implementation Method 2
a solution in which a low molecular organic material is dissolved in a highly volatile solvent, as a sublimation material containing liquid
Implementation Method 3
changing the rotation acceleration to apply a shear force and eliminate association states
Data Source
AI summary
A substrate processing method according to an embodiment is a substrate processing method for drying a substrate. The substrate processing method includes supplying a solution in which a sublimation material is dissolved in a first solvent to a surface of a cleaned substrate. The substrate processing method includes eliminating at least a portion of association states of the sublimation material. The substrate processing method includes precipitating the sublimation material on the surface of the substrate. The substrate processing method includes removing the precipitated sublimation material by sublimation.