Substrate Drying Solvent Sequence for Watermark Suppression
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Solution Overview
Problem
Existing substrate processing methods face challenges in suppressing the formation of watermarks while maintaining cost-effectiveness, often requiring additional heating sources and moisture-absorbing devices to prevent condensation and absorption of moisture.
Innovation Solution
A substrate processing method involving sequential supply of cleaning, rinse, and organic solvents with specific solubility and boiling point characteristics, where the second organic solvent has lower water solubility and higher boiling point than the first, facilitating effective removal of previous solvents without moisture retention, thereby eliminating the need for additional heating or moisture control devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional heating sources and moisture-absorbing devices are used to prevent condensation and absorption of moisture, then watermark formation is suppressed, but processing cost increases
Solution Approach 1:
The patent introduces an intermediate organic solvent layer between the aqueous rinse liquid and the atmosphere. This organic solvent layer acts as a barrier that prevents moisture from the atmosphere from condensing on the substrate surface during drying, eliminating the need for heating sources or moisture-absorbing devices while effectively suppressing watermark formation
Solution Approach 2:
The patent changes the physical and chemical parameters of the drying process by using an organic solvent with specific properties (lower surface tension, different volatility) instead of direct air drying or heated drying. This parameter change allows the substrate to be dried without additional heating equipment while preventing moisture condensation
2Reliability
If additional heating sources and moisture-absorbing devices are used to prevent condensation and absorption of moisture, then watermark formation is suppressed, but equipment complexity increases
Solution Approach 1:
The organic solvent serves as an intermediary substance that physically separates the substrate surface from the atmospheric moisture. This intermediary layer prevents direct contact between moisture and the substrate, eliminating the need for complex heating or dehumidification equipment
Solution Approach 2:
The organic solvent layer performs the moisture-prevention function automatically through its inherent physical properties (surface tension, volatility). The system uses the natural characteristics of the organic solvent to prevent watermark formation without requiring additional active control equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses watermark formation and reduces processing costs by preventing moisture retention and vaporization, ensuring efficient solvent replacement without additional equipment.
Implementation Method 1
forming, by supplying a second organic solvent to the substrate while rotating the substrate, a liquid film of the second organic solvent on the substrate and removing the first organic solvent from the substrate
Implementation Method 2
The second organic solvent may have water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent
Data Source
AI summary
A substrate processing method includes forming, by supplying a cleaning liquid, a liquid film of the cleaning liquid on the substrate; forming, by supplying a rinse liquid, a liquid film of the rinse liquid on the substrate, after the forming of the liquid film of the cleaning liquid; forming, by supplying a first organic solvent, a liquid film of the first organic solvent on the substrate, after the forming of the liquid film of the rinse liquid; forming, by supplying a second organic solvent, a liquid film of the second organic solvent on the substrate, after the forming of the liquid film of the first organic solvent; and drying the substrate after the forming of the liquid film of the second organic solvent. The second organic solvent has water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent.