Substrate Drying With Sublimable Support for Pattern Collapse

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

During the manufacturing of semiconductor devices and other micro-electromechanical systems, the removal of liquids after treatment can cause minute structural bodies to collapse due to surface tension, especially as patterns are downsized and aspect ratios increase, leading to pattern collapse issues.

Innovation Solution

A substrate processing method involving the use of a support member formed by changing a second liquid into a solid, which is then removed directly from the solid phase to the gaseous phase without passing through the liquid phase, thereby reducing the impact of surface tension on structural bodies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If liquid is removed after treatment, then processing is completed, but minute structural bodies collapse due to surface tension

Engineering Contradiction:
Improveprocessing completionVSAvoidstructural body integrity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A support member is formed on the substrate before liquid removal to provide mechanical support to the minute structural bodies. This preliminary structural reinforcement prevents collapse during the subsequent liquid removal process, allowing complete processing while maintaining manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The support member acts as an intermediary element between the liquid and the minute structural bodies. It absorbs and redistributes the surface tension forces, preventing direct transmission of harmful forces to the structural bodies during liquid removal, thus resolving the contradiction between processing completion and structural integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If patterns are downsized and aspect ratios increased, then device functionality is improved, but pattern collapse becomes more likely

Engineering Contradiction:
Improvedevice functionalityVSAvoidpattern stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The support member is formed in advance on substrates with downsized patterns and high aspect ratios before liquid treatment. This preliminary support structure compensates for the reduced inherent stability of miniaturized patterns, enabling advanced device functionality while maintaining pattern reliability during processing.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If freezing processes are used to remove liquid, then pattern collapse is suppressed, but equipment complexity and cost increase

Engineering Contradiction:
Improvepattern integrityVSAvoidequipment configuration
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention replaces the complex mechanical freezing system with a simpler chemical/physical support member formation process. The support member provides mechanical protection through material properties rather than complex cryogenic equipment, achieving pattern integrity while significantly reducing equipment complexity and cost.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The support member is a temporary, easily removable structure that serves its protective function during liquid removal and then is discarded. This disposable approach avoids the need for expensive, complex freezing equipment while achieving the same protective effect, reducing both equipment complexity and processing cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively suppresses pattern collapse during drying, maintaining the integrity of structural bodies and improving processing efficiency by avoiding the need for complex and costly freezing processes, while allowing for simpler equipment configuration and shorter processing times.

Implementation Method 1

removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase

Methodology Applied
Scientific EffectSublimation: Sublimation

Data Source

PatentUS11921428B2Substrate processing method and substrate processing apparatus
Publication Date: 2024.03.05 KIOXIA CORP
  • US11921428B2 patent drawing
  • US11921428B2 patent drawing
  • US11921428B2 patent drawing

AI summary

According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.