Substrate Drying Apparatus Using Supercritical Fluid Inversion
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Solution Overview
Problem
Existing substrate drying technologies face challenges in efficiently replacing liquid films on substrates with supercritical fluids, leading to surface tension issues that can cause irregularity pattern collapse and require complex mechanisms for fluid handling and pressure management.
Innovation Solution
A substrate processing apparatus with a pressure vessel, cover body, and supporting body that fixes the substrate within the drying chamber, allowing for direct supercritical fluid replacement of liquid films without rotating the substrate, reducing backlash and vibration, and enabling efficient scaling down of the drying unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is rotated to replace liquid film with supercritical fluid, then the drying effectiveness is improved, but backlash and vibration occur causing manufacturing precision degradation
Solution Approach 1:
Instead of rotating the substrate to achieve fluid replacement, the patent inverts the approach by rotating the supercritical fluid itself while keeping the substrate stationary. The substrate is held horizontally on a support table, and the supercritical fluid is circulated and rotated within the processing chamber, allowing the fluid to dynamically replace the liquid film on the substrate surface without subjecting the substrate to rotational forces that cause backlash and vibration.
2Reliability
If complex mechanisms are used for fluid handling and pressure management, then the supercritical fluid replacement is achieved, but device complexity increases
Solution Approach 1:
The support table serves multiple functions: it holds the substrate horizontally, supports the substrate during the drying process, and acts as a platform for the supercritical fluid circulation system. The processing chamber simultaneously provides containment for the supercritical fluid, heating zone, and rotation mechanism for the fluid. This multi-functionality reduces the number of separate components needed while maintaining reliable fluid replacement.
Solution Approach 2:
The patent combines the substrate support function with the fluid circulation function in a unified system. The support table that holds the substrate also serves as the base for the supercritical fluid circulation system, merging structural support and fluid handling into a single integrated component, thereby simplifying the overall device architecture.
3Manufacturing precision
If the substrate is held horizontally without rotation, then backlash and vibration are reduced improving manufacturing precision, but the ability to replace liquid film with supercritical fluid is worsened
Solution Approach 1:
The patent applies the inversion principle by keeping the substrate stationary and horizontal while rotating and circulating the supercritical fluid instead. This approach maintains the substrate's stable horizontal orientation for precision while achieving effective fluid replacement through the dynamic movement of the supercritical fluid itself, which circulates around and over the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses surface tension effects on substrates, allowing for precise and efficient drying while minimizing equipment size and maintaining high processing quality, thus enhancing substrate processing efficiency and reducing the risk of liquid film overflow and contamination.
Implementation Method 1
drying a substrate by replacing a liquid film formed on a top surface of the substrate with a supercritical fluid
Implementation Method 2
replacing a liquid film formed on a top surface of the substrate with a supercritical fluid
Data Source
AI summary
A substrate processing apparatus is configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid. The substrate processing apparatus includes a pressure vessel, a cover body and a supporting body. The pressure vessel has therein a drying chamber for the substrate. The cover body is configured to close an opening of the drying chamber. The supporting body is configured to support the substrate horizontally within the drying chamber. The supporting body is fixed to the drying chamber.