Substrate Drying with Staged Supercritical Fluid Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate drying processes using supercritical fluid face inefficiencies due to density differences caused by temperature variations, leading to poor drying outcomes.
Innovation Solution
A method and apparatus that control the temperature and pressure of supercritical fluid supply during the drying process by sequentially supplying supercritical fluid at different temperatures and pressures, ensuring consistent density throughout the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If supercritical fluid is supplied at high temperature during pressurizing step, then the pressure reaches set value faster, but the density of supercritical fluid becomes lower causing poor drying efficiency
Solution Approach 1:
The pressurizing process is divided into multiple stages with different temperature conditions. The first pressurizing step uses higher temperature for faster pressure buildup, while the second pressurizing step uses lower temperature to achieve desired density. This segmentation allows optimization of both pressurizing speed and fluid density at different phases of the process.
Solution Approach 2:
The system performs preliminary pressurizing at higher temperature to quickly reach near-target pressure, then transitions to lower temperature pressurizing to fine-tune the density. This preliminary action at favorable conditions (high temperature for speed) is followed by corrective action to achieve the final desired state.
2Adaptability or versatility
If supercritical fluid temperature is varied during processing, then processing flexibility increases, but density inconsistency occurs leading to poor drying outcomes
Solution Approach 1:
The system dynamically adjusts temperature and pressure parameters based on the processing stage. During pressurizing, temperature is adjusted to control density; during substrate processing, temperature is optimized for cleaning effectiveness. This dynamic adaptation allows the system to maintain optimal density at each stage while providing processing flexibility.
Solution Approach 2:
The invention systematically changes temperature and pressure parameters according to process requirements. By controlling the timing and magnitude of parameter changes, the system achieves both processing flexibility and density consistency - using lower temperatures during pressurizing to maintain density, and adjusting parameters during processing for optimal cleaning performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves processing efficiency and prevents poor drying by maintaining consistent fluid density, enhancing the drying effectiveness of substrates.
Implementation Method 1
a heating unit (575) installed in the fluid supply line (565) and heating the supercritical fluid
Implementation Method 2
a pressurizing step of pressurizing the processing space to a first pressure by supplying supercritical fluid to the processing space
Implementation Method 3
a processing step of processing the substrate in the processing space by supplying the supercritical fluid to the processing space after the pressurizing step
Data Source
AI summary
The present invention provides a substrate drying method and a substrate drying apparatus. The substrate drying method includes a pressurizing step, a processing step, and a depressurizing step, in which the pressurizing step includes a first supply step of supplying supercritical fluid at a first temperature and a second supply step of supplying, thereafter, the supercritical fluid at a second temperature higher than the first temperature. Thereafter, in the processing step, a substrate is processed with the supercritical fluid by supplying the supercritical fluid at a third temperature the same as or higher than the second temperature.