Substrate Drying Chamber Temperature Sensing for Defect Prevention
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Solution Overview
Problem
The uneven distribution of supercritical fluid due to temperature deviations in substrate processing containers during the semiconductor manufacturing process leads to defects in substrates, which are not effectively addressed by existing temperature measurement systems.
Innovation Solution
A substrate processing apparatus and method that includes surface temperature measurement sensors in a transfer robot to accurately measure the temperature of substrate processing containers, ensuring substrates are only loaded when within a preset temperature range, thereby preventing uneven fluid distribution and potential defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate processing container is heated to create a supercritical environment for drying, then the drying efficiency is improved, but the surface temperature distribution becomes uneven causing defects in the substrate
Solution Approach 1:
The patent applies preliminary action by measuring the surface temperature of the substrate processing container before loading the substrate. The temperature measurement is performed in advance to determine whether the container has cooled sufficiently to ensure uniform temperature distribution. This preliminary check prevents substrate defects by ensuring the container is in the appropriate temperature state before the drying process begins.
Solution Approach 2:
The patent implements feedback by using a temperature measurement sensor to continuously monitor the surface temperature of the substrate processing container. The measured temperature information is fed back to control whether substrate loading should proceed. This feedback mechanism ensures that substrate is only loaded when the temperature is within the acceptable range, thereby maintaining uniform supercritical fluid distribution and preventing defects.
2Productivity
If the substrate processing container is loaded immediately after drying, then the productivity is improved, but the temperature deviation causes uneven fluid distribution and substrate defects
Solution Approach 1:
The patent applies preliminary action by performing temperature measurement and evaluation before substrate loading. The controller determines whether the container temperature has returned to the preset range before allowing the next substrate to be loaded. This preliminary verification ensures that even though the process moves quickly, substrate quality is not compromised by temperature deviations.
Solution Approach 2:
The patent implements feedback by using temperature measurement results to control the substrate loading timing. The system continuously monitors container temperature and only permits substrate loading when the temperature is within the acceptable range. This feedback-based control mechanism balances productivity with reliability by preventing defective substrates from being processed while maintaining efficient workflow.
3Device complexity
If the surface temperature of the substrate processing container is not monitored, then the device complexity is reduced, but substrate defects occur due to ununiform supercritical fluid distribution
Solution Approach 1:
The patent replaces complex internal temperature measurement systems with a simpler external surface temperature measurement approach. Instead of measuring temperature inside the container or using complex sensor arrays, the system uses a temperature measurement sensor to measure the outer surface temperature of the substrate processing container. This substitution maintains substrate quality control while significantly simplifying the device structure and reducing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate defects by ensuring the substrate processing container temperature is within a suitable range, maintaining uniform fluid distribution and enhancing the reliability of the semiconductor manufacturing process.
Implementation Method 1
a surface temperature measurement sensor configured to measure a surface temperature of the substrate processing container
Implementation Method 2
a supercritical drying process of drying the substrate by using supercritical fluid
Implementation Method 3
has excellent diffusivity and water permeability
Implementation Method 4
has high solubility
Data Source
AI summary
A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.