Substrate Drying Flow Path With Throat Structure for Edge Turbulence

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In semiconductor manufacturing, the use of supercritical fluids for drying substrates can cause turbulent flow near the edge of the substrate, leading to pattern collapse due to shear stress, especially as patterns become miniaturized.

Innovation Solution

A substrate treating apparatus with a throat structure in the fluid flow path that narrows and widens the flow path to control turbulent flow and reduce shear stress, using a shielding plate and movable components to support the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If supercritical fluid is supplied to the substrate treating space, then the substrate drying function is improved, but turbulent flow occurs near the edge of the substrate causing pattern collapse

Engineering Contradiction:
Improvesubstrate drying functionVSAvoidturbulent flow and shear stress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A shielding plate is introduced as an intermediary component between the supercritical fluid supply and the substrate. The plate has a flow path with a throat structure that mediates the fluid flow, converting turbulent flow into laminar flow before the fluid reaches the substrate edge, thereby preventing pattern collapse while maintaining effective drying

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The throat structure in the shielding plate changes the flow parameters of the supercritical fluid by narrowing the flow path cross-section at the throat portion. This parameter change transforms the flow regime from turbulent to laminar, reducing shear stress on the substrate pattern while maintaining drying effectiveness

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If the fluid flow path is narrowed to reduce turbulent flow, then shear stress is reduced, but fluid flow resistance increases

Engineering Contradiction:
Improveshear stressVSAvoidfluid flow resistance
Core Design Contradiction:
Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The shielding plate with throat structure dynamically adjusts the flow path cross-section - narrow at the throat to reduce shear stress, then expands afterward to reduce flow resistance. This dynamic geometry optimization balances both requirements of shear stress reduction and energy efficiency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The flow path design transitions from a two-dimensional planar view to a three-dimensional structure with varying cross-sections. The throat structure creates a localized narrowing in one dimension while maintaining adequate flow area in other dimensions, reducing shear stress without proportionally increasing overall flow resistance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The throat structure effectively minimizes turbulent flow and shear stress, preventing pattern collapse in the edge area of the substrate during the drying process.

Implementation Method 1

turbulent flow may occur near an edge of the substrate, causing the pattern to experience shear stress

Methodology Applied
Scientific EffectTurbulent flow: Turbulence

Implementation Method 2

the pattern to experience shear stress. As a result of the shear stress, pattern collapse may occur

Methodology Applied
Scientific EffectShear stress: Shear Stress

Implementation Method 3

a drying process that uses a supercritical fluid

Methodology Applied
Scientific EffectSupercritical fluid: Supercritical Fluid

Implementation Method 4

drying process that uses a supercritical fluid

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS20250372409A1Substrate treating apparatus and semiconductor manufacturing equipment including the same
Publication Date: 2025.12.04 SAMSUNG ELECTRONICS CO LTD
  • US20250372409A1 patent drawing
  • US20250372409A1 patent drawing
  • US20250372409A1 patent drawing

AI summary

A substrate treating apparatus to minimize the occurrence of turbulent flow in the edge direction of the substrate and semiconductor manufacturing equipment including the substrate treating apparatus are provided. The substrate treating apparatus includes an upper module including a first supply port providing supercritical fluid to a substrate treating space, a lower module coupled to the upper module and including a second supply port providing the supercritical fluid to the substrate treating space, a shielding plate disposed in the substrate treating space, a plate support coupled to the lower module and supporting the shielding plate, and a first substrate support coupled to the shielding plate and supporting the substrate. A fluid flow path between the lower module and the shielding plate includes a throat structure changing a cross-sectional size of the fluid flow path.