Substrate Drying Vessel Thermal Decomposition Contamination Control

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Solution Overview

Problem

Existing methods for processing substrates using supercritical fluids in IC device manufacturing often result in contamination due to residual sources within the processing vessel being adsorbed onto the substrate, leading to contamination issues.

Innovation Solution

An apparatus and method involving a vessel with separate supply ports for supercritical and non-reactive fluids, where the non-reactive fluid of a higher temperature is used to thermally decompose contamination sources within the processing space, preventing contamination by venting out the contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a supercritical fluid is used to process a substrate, then cleaning and drying effectiveness is improved, but substrate contamination occurs due to adsorption of remaining contamination sources

Engineering Contradiction:

Improvecleaning and drying effectivenessVSAvoidsubstrate contamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The contamination source is thermally decomposed in advance before the substrate is processed by the supercritical fluid. By removing the contamination source through thermal decomposition at a predetermined temperature, the substrate is prevented from being contaminated during subsequent supercritical fluid processing, while still maintaining the cleaning and drying benefits of the supercritical fluid method

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The contamination source that would normally cause harm through adsorption onto the substrate is converted into a beneficial effect by using its thermal decomposition to clean the processing space. The heat treatment breaks down the contamination source into harmless substances, transforming it from a harmful factor into a means of purifying the processing environment

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Object-affected harmful factors

If the vessel is opened to remove contamination sources, then contamination is reduced, but processing time increases due to opening and closing operations

Engineering Contradiction:

Improvecontamination levelVSAvoidprocessing time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The mechanical operation of opening and closing the vessel to remove contamination sources is replaced by a thermal field approach. Thermal decomposition is applied to break down the contamination source in situ, eliminating the need for mechanical vessel opening and closing operations, thereby reducing processing time while maintaining contamination control

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The temperature parameter is changed to a predetermined level that enables thermal decomposition of the contamination source. By controlling the temperature parameter, the contamination source is decomposed without requiring vessel opening, achieving both contamination reduction and time efficiency through parameter-based control rather than mechanical operations

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents substrate contamination by thermally decomposing and removing residual contamination sources from the processing vessel, ensuring cleaner substrates and improved manufacturing efficiency.

Implementation Method 1

a second supply port through which a non-reactive fluid of a second temperature that is higher than the first temperature is supplied to the vessel

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 2

thermally decomposing and removing residual contamination sources from the processing vessel

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 3

a first supply port through which a supercritical fluid of a first temperature is supplied to the vessel

Methodology Applied

Scientific EffectSupercritical fluid extraction: Supercritical Fluid Extraction

Implementation Method 4

drying the substrate using a supercritical fluid

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS10406567B2Apparatus and methods for substrate processing and manufacturing integrated circuit devices

Publication Date: 2019.09.10 SAMSUNG ELECTRONICS CO LTD

AI summary

A method for processing a substrate includes: loading a substrate in a processing space of a vessel; drying the substrate using a supercritical fluid of a first temperature in the processing space, and thermally decomposing a contamination source disposed in the processing space by transferring heat to the processing space by using a non-reactive fluid of a second temperature that is higher than the first temperature.