Substrate Processing Method Using Dummy Patterns for Side Surface Coatings
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Solution Overview
Problem
Existing substrate processing methods require multiple steps and fail to efficiently form multiple electrode patterns separated from each other on the side surface of a submount, particularly in preventing burrs and peeling during the dicing process.
Innovation Solution
A substrate processing method involving substrate preparation, pattern formation, mask arrangement, coating formation using a stencil mask with opening patterns, and separation to create a body portion with coatings separated on the side surface, utilizing a dummy pattern with protrusions to control coating placement and prevent metal film formation on the side surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple sputtering and metal film patterning steps are performed to form electrode patterns, then the electrode patterns can be formed on upper and side surfaces, but the number of processing steps increases
Solution Approach 1:
The patent introduces dummy patterns with protrusions that segment the coating formation process. The protrusions create physical barriers that prevent coating material from reaching certain side surface regions, allowing different electrode patterns to be formed in different areas through a single coating step. This segmentation approach eliminates the need for multiple sputtering and patterning steps while maintaining precise electrode pattern formation.
Solution Approach 2:
The dummy patterns act as intermediary structures during the coating process. These dummy patterns with protrusions serve as temporary elements that control where the coating material deposits on the side surface. After the coating is formed, the dummy patterns are removed, leaving behind the desired electrode patterns. This intermediary approach simplifies the overall process by using a single coating step instead of multiple sputtering and patterning cycles.
2Manufacturing precision
If metal film is formed on through-grooves by sputtering, then electrode patterns can be created, but burrs and peeling occur during dicing
Solution Approach 1:
The patent applies preliminary anti-action by forming dummy patterns with protrusions before the coating process. These protrusions pre-emptively block the coating material from reaching the groove regions where burrs and peeling would occur during dicing. By preventing the metal film from forming in these problematic areas in the first place, the method eliminates burr formation and peeling issues without requiring additional protective measures during the dicing process.
3Adaptability or versatility
If multiple electrode patterns are formed separately on a single submount, then power lines and ground lines can be created, but the coating formation process becomes complex
Solution Approach 1:
The patent uses dummy patterns with protrusions to segment the side surface into different regions. Each region can receive coating material independently through a single coating process, allowing multiple electrode patterns (such as power lines and ground lines) to be formed simultaneously. The protrusions act as physical dividers that ensure coating material deposits only in intended areas, creating multiple separate electrode patterns without requiring multiple coating steps or complex masking processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the simple formation of separated coatings on the side surface of the submount, reducing processing steps and preventing short circuits, while maintaining the reliability and characteristics of the device mounted on the submount by controlling the formation of electrodes and coatings.
Implementation Method 1
the coating formation step of forming a coating on the substrate through the multiple opening patterns
Data Source
AI summary
The method for processing a substrate includes the substrate preparation step of preparing the substrate, the pattern formation step of forming dummy patterns extending in an X-direction on the substrate, the mask arrangement step of arranging a stencil mask having multiple opening patterns on the substrate, the coating formation step of forming a metal film on the substrate through the multiple opening patterns, and the separation step of separating the dummy patterns from the substrate to obtain a submount. The dummy pattern has protrusion formed such that a side surface of the submount is exposed and formed close to the side surface with a clearance.