Mother Substrate Dummy Resistance Layer Corrosion Protection

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Solution Overview

Problem

In organic light-emitting display apparatus manufacturing, pads connected through test wirings can be isolated and prone to corrosion during the patterning process of the pixel electrode due to the etchant used, leading to potential defects in the display apparatus.

Innovation Solution

A mother substrate design that includes a dummy resistance layer connecting test wirings to pads through bridge wiring, preventing galvanic corrosion by ensuring continuous electrical connection and reducing interference with the electrical signal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pads are connected through test wirings using a circuit unit including thin film transistor, then electrical connection is achieved, but pads become substantially isolated and prone to corrosion during patterning process

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidpad corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A dummy resistance layer is introduced as an intermediary element between the pad and the test wiring circuit unit. This dummy resistance layer serves as a mediator that maintains electrical continuity and provides corrosion protection to the pad during the patterning process, while allowing the circuit unit to function normally for electrical connection purposes.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The dummy resistance layer is formed in advance before the patterning process occurs. By preliminarily establishing this protective layer that maintains electrical connection, the pad is pre-protected against the harmful effects of etchant exposure during subsequent patterning operations, preventing corrosion before it can occur.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If pads are isolated through circuit units, then electrical signal transmission is enabled, but pad corrosion resistance decreases during etching process

Engineering Contradiction:
Improveelectrical signal transmissionVSAvoidpad corrosion resistance
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The dummy resistance layer acts as a protective intermediary between the pad and the etchant environment. It maintains the electrical signal transmission pathway while shielding the pad from direct exposure to corrosive etchants, thus preserving pad strength and corrosion resistance during the patterning process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The dummy resistance layer provides beforehand cushioning protection to the pad against etchant corrosion. By being in place prior to the patterning process, it cushions the pad from the harmful effects of etching, maintaining both electrical signal transmission capability and structural integrity during the manufacturing process.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dummy resistance layer effectively prevents corrosion of pads and bridge wiring during the patterning process, ensuring the integrity of the organic light-emitting display apparatus and facilitating the separation of panel areas without defects.

Implementation Method 1

preventing galvanic corrosion by ensuring continuous electrical connection

Methodology Applied
Scientific EffectGalvanic corrosion prevention:

Data Source

PatentUS8981378B2Mother substrate for organic light-emitting display apparatus
Publication Date: 2015.03.17 SAMSUNG DISPLAY CO LTD
  • US8981378B2 patent drawing
  • US8981378B2 patent drawing
  • US8981378B2 patent drawing

AI summary

A mother substrate for an organic light-emitting display apparatus. The mother substrate has a panel area and a peripheral area surrounding the panel area, pixels disposed in a display area of the panel area, pads that are disposed in a non-display area of the panel area and are coupled to the pixels, test wirings disposed in the peripheral area, a local buffer electrically connected to the test wirings, a bridge wiring connecting the local buffer to one of the pads, and a dummy resistance layer having one end in contact with the bridge wiring and another end in contact with one of the test wirings.