Substrate Edge Adhesive Removal With Protective Cover Liquid
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Solution Overview
Problem
The existing methods for removing adhesive from substrates during semiconductor processing are inefficient and can damage the substrates and support plates due to the risk of pattern damage from removal liquids, leading to increased processing time and equipment damage.
Innovation Solution
An apparatus and method that includes a support unit for rotating the object, a liquid dispensing unit with a processing liquid nozzle for removing adhesive and a cover liquid nozzle for protecting the substrate, and a controller to adjust flow rates and temperatures to maintain constant adhesive removal rates, using a cover liquid that dilutes the processing liquid and an adjustment liquid to maintain support plate temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flow rate and temperature of the removal liquid are lowered to protect the substrate, then the damage risk to the substrate is reduced, but the removal efficiency of the adhesive is lowered
Solution Approach 1:
The liquid dispensing unit is divided into two separate systems: a processing liquid dispensing member that dispenses removal liquid onto the adhesive, and a cover liquid dispensing member that dispenses protective liquid onto the substrate. This segmentation allows each liquid to be optimized independently for its specific function without compromising the other.
Solution Approach 2:
Different liquids are applied to different areas of the object: the processing liquid is applied locally to the exposed adhesive area for effective removal, while the cover liquid is applied to the substrate area to provide protection. This local quality approach ensures that the substrate is protected from damage while the adhesive removal efficiency is maintained.
2Productivity
If the removal liquid is dispensed at higher flow rate and temperature to improve removal efficiency, then the adhesive removal speed increases, but the substrate and support plate are damaged
Solution Approach 1:
The cover liquid acts as an intermediary protective layer between the processing liquid and the substrate. It allows the processing liquid to effectively remove the adhesive while preventing direct contact between the processing liquid and the substrate, thereby eliminating the harmful effects of high flow rate and temperature on the substrate.
Solution Approach 2:
The cover liquid is applied to the substrate before or during the processing liquid application to preemptively protect the substrate from potential damage. This preliminary protective action prevents the harmful effects of the processing liquid from affecting the substrate while still allowing effective adhesive removal.
3Productivity
If the removal liquid is dispensed onto the adhesive, then the adhesive removal process is performed, but part of the removal liquid is scattered to cause damage to the substrate and apparatuses
Solution Approach 1:
The dispensing system is segmented into separate nozzles for processing liquid and cover liquid, with each nozzle targeted at specific areas. This segmentation prevents liquid scattering by ensuring that each liquid is dispensed in a controlled manner onto its designated area, reducing the risk of liquid reaching and damaging the substrate or surrounding apparatuses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency of adhesive removal while protecting the substrate and support plate, preventing damage and maintaining consistent removal rates by using a controlled flow of liquids with adjusted temperatures and flow rates.
Implementation Method 1
The exposed adhesive 'a' is removed by dispensing a removal liquid onto the area where the adhesive 'a' is exposed
Implementation Method 2
a cover liquid nozzle that dispenses a cover liquid that protects the substrate from the processing liquid
Implementation Method 3
an upper heater that heats the processing liquid to a process temperature higher than room temperature
Implementation Method 4
the cover liquid dispensing member may further include a cooler that cools the cover liquid to a cooling temperature lower than the process temperature
Implementation Method 5
a lower heater that heats the adjustment liquid to a heating temperature higher than the room temperature
Data Source
AI summary
Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.