Substrate Edge Cleaning Nozzle Cover to Prevent Impurity Scattering
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Solution Overview
Problem
Existing substrate processing methods result in thin films forming on unintended areas, leading to peeling and reduced yield, as impurities scatter during the processing of substrates like semiconductor wafers.
Innovation Solution
A cleaning apparatus with a nozzle and cover structure that sprays cleaning liquid obliquely to cover and protect substrate edges, using misted cleaning liquid to efficiently remove thin films from front, rear, and side surfaces while preventing scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cleaning liquid is sprayed directly onto substrate edges, then cleaning effectiveness is improved, but impurities scatter onto the substrate causing yield reduction
Solution Approach 1:
The patent introduces a cover structure as an intermediary component between the nozzle and substrate. The cover includes a placement groove that receives the substrate edge and directs cleaning liquid flow, preventing scattered impurities from contacting the substrate surface while maintaining effective cleaning at the edges
2Area of stationary object
If cleaning liquid is sprayed at oblique angles to cover all substrate surfaces, then cleaning coverage is improved, but liquid distribution control becomes difficult
Solution Approach 1:
The cover structure is segmented into multiple functional portions: a placement groove for substrate edge positioning, a first cover portion for directing liquid flow, and a second cover portion for receiving and containing scattered liquid. This segmentation allows each portion to perform its specific function while collectively achieving comprehensive coverage with controlled distribution
3Productivity
If substrate edges are not properly protected, then processing speed is maintained, but thin films peel off reducing yield
Solution Approach 1:
The placement groove is designed to preliminarily position and secure the substrate edge before the cleaning process begins. This preliminary action ensures that the substrate edge is properly received and protected throughout the cleaning operation, preventing thin film peeling and maintaining both processing speed and yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes thin films from substrate edges, preventing scattering and maintaining processing efficiency by ensuring precise application of cleaning liquid, thereby enhancing yield and substrate quality.
Implementation Method 1
a nozzle extension body having a first aperture at a first end coupled to the nozzle and a second aperture at a second end, the first aperture and the second aperture connected by a fluid passage in the nozzle extension body
Implementation Method 2
a cover that encloses the second aperture to receive the cleaning liquid from the second aperture
Implementation Method 3
The substrate support includes a rotating support portion configured to rotate the substrate along a rotation axis in a horizontal plane
Data Source
AI summary
Provided is a cleaning apparatus that includes a nozzle configured to spray cleaning liquid, a nozzle extension comprising a nozzle extension body having a first aperture and a second aperture connected by a fluid passage in the nozzle extension body, the first aperture aligned with the nozzle and the second aperture for discharging the cleaning liquid, and the first aperture and the second aperture each have a normal direction oblique to each other, and a cover that encloses the second aperture and that comprises a first cover portion configured to cover at least a portion of a front surface of a substrate, a second cover portion configured to cover at least a portion of a rear surface of the substrate, and a third cover portion configured to cover at least a portion of a side of the substrate edge, wherein the cover comprises a placement groove configured to receive the substrate edge.