Substrate Edge Detection for Semiconductor Alignment

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Solution Overview

Problem

In semiconductor device manufacturing, the existing pattern forming processes face challenges with substrate alignment efficiency, leading to increased time requirements and potential defects due to positional displacement during transfer and alignment within pattern forming apparatuses.

Innovation Solution

A pattern forming apparatus equipped with a transfer unit, a placing table, and position detecting units that correct positional displacement of substrates using edge detection and control mechanisms, enabling precise alignment and reducing alignment time by detecting and correcting positional deviations before and during exposure processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrate alignment is performed inside the pattern forming apparatus using conventional methods, then the substrate can be processed, but the alignment time is excessively long

Engineering Contradiction:
Improvealignment speedVSAvoidalignment time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The substrate position is detected preliminarily at the transfer source before transfer occurs. The detection unit measures the substrate position in the transfer source, and the control unit calculates the required transfer amount based on this preliminary detection, enabling fast and accurate transfer without time-consuming alignment inside the processing unit

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conventional mechanical alignment system inside the processing unit is replaced with a detection-and-calculate system. Instead of using mechanical adjustment mechanisms to align substrates inside the apparatus, the system uses position detection at the transfer source and calculates the precise transfer amount needed, substituting mechanical alignment with computational positioning

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If substrate transfer is performed without position detection, then the transfer process is simple, but positional displacement occurs leading to alignment errors

Engineering Contradiction:
Improvesubstrate alignment precisionVSAvoidapparatus structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A detection unit is introduced as an intermediary between the transfer source and the processing unit. This detection unit measures the substrate position and provides data to the control unit, which calculates the appropriate transfer amount. The intermediary detection system enables precise alignment without requiring complex mechanical alignment mechanisms in both the transfer source and processing unit

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system implements feedback by detecting the actual substrate position at the transfer source and using this information to calculate the precise transfer amount needed. The control unit receives position feedback from the detection unit and adjusts the transfer operation accordingly, ensuring accurate substrate placement in the processing unit

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS10510569B2Pattern forming apparatus and manufacturing method for semiconductor device
Publication Date: 2019.12.17 KIOXIA CORP
  • US10510569B2 patent drawing
  • US10510569B2 patent drawing
  • US10510569B2 patent drawing

AI summary

A pattern forming apparatus according to an embodiment includes: a pre-alignment unit that performs pre-alignment for a substrate; a transfer unit that transfers the substrate into the pre-alignment unit; a placing table on which the substrate transferred into the pre-alignment unit is placed; a position detecting unit provided at a position included in the placing table and overlapping with an edge of the substrate, and adapted to detect a position of the edge of the substrate; and a control unit that calculates a positional displacement amount of the substrate from the position of the edge of the substrate detected by the position detecting unit, and controls the placing table on the basis of the positional displacement amount of the substrate to correct the position of the substrate.