Package Substrate Temporary Carrier Edge Encapsulation
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Solution Overview
Problem
The conventional coreless process for manufacturing multi-layer circuit boards faces challenges with the instability of thin substrates, leading to increased failure rates and handling difficulties due to insufficient rigidity and relative movements during manufacturing and separation processes.
Innovation Solution
A package substrate manufacturing method involving a temporary carrier with a copper and dielectric layer structure, where the edges of the second copper layer are retracted, and the first and second dielectric layers completely encapsulate these edges to enhance strength and uniformity, allowing for stable handling and easy separation into independent substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the core substrate thickness is reduced to meet thin electronic component requirements, then the thickness of the package substrate is reduced, but the rigidity of the substrate is insufficient leading to handling difficulties and increased failure rate
Solution Approach 1:
The substrate structure is segmented into multiple functional layers: a flexible thin core substrate for signal transmission, a separate carrier panel for mechanical support, and encapsulating dielectric layers for structural integrity. This segmentation allows each layer to perform its specialized function without compromising overall performance.
Solution Approach 2:
The invention uses a composite structure combining the thin core substrate with the carrier panel and dielectric layers. The carrier panel provides the necessary rigidity and mechanical strength, while the thin core substrate maintains the required thickness for thin electronic components. The combination resolves the contradiction between thinness and rigidity.
2Ease of manufacture
If only partial edges of the carrier and multi-layer circuit board are bonded together in the conventional coreless process, then the bonding process is simple, but relative movements are easily produced during manufacturing processes leading to increased failure rate
Solution Approach 1:
The carrier panel serves multiple functions: it provides mechanical support during manufacturing, enables complete edge bonding for stability, and facilitates easy separation after the circuit board is completed. This multi-functionality resolves the contradiction between bonding simplicity and manufacturing stability.
Solution Approach 2:
The complete edge bonding is performed preliminarily at the beginning of the manufacturing process to ensure stability during all subsequent manufacturing steps. This preliminary action prevents relative movements and ensures reliability throughout the manufacturing process, with the understanding that separation will be needed later.
3Ease of manufacture
If the carrier and multi-layer circuit board are bonded only at particular parts, then the bonding process is simple, but deformation is produced at parts where the carrier and circuit board are not bonded
Solution Approach 1:
The bonding interface is segmented from the traditional point or partial edge bonding to complete edge bonding across the entire perimeter. This segmentation approach distributes the mechanical stress uniformly along the entire edge, preventing localized deformation while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the strength and swelling-shrinkage uniformity of the temporary carrier, reducing failure rates and improving the yield of the manufacturing and separation processes by providing a stable carrier that can be easily separated into independent package substrates.
Implementation Method 1
Laminating the first copper layer, the first dielectric layer, the second copper layer, the second dielectric layer and the third copper layer such that the first dielectric layer and the second dielectric layer completely encapsulate the edges of the second copper layer
Data Source
Figure 1A~1C
Figure 1D~1E
Figure 1F~1G
AI summary
A method of manufacturing a package substrate is provided. A first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper layer formed thereon are provided and laminated, so that the first and the second dielectric layers encapsulate edges of the second copper layer and the second plating copper layer to form a temporary carrier. Two circuit structures are formed on two opposite surfaces of the temporary carrier. The temporary carrier and the circuit structures are cut to expose the edges of the second copper layer and the second plating copper layer, and separated along the exposed edges of the second copper layer and the second plating copper layer to form two package substrates independent from each other.