Substrate Edge Film Cleaning via Sequential Drying and Chemical Application
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Solution Overview
Problem
Existing substrate processing methods face challenges in suppressing metal contamination associated with the use of metal-containing films, as metal components can elute from the films during chemical liquid application, leading to contamination on the substrate and equipment.
Innovation Solution
A substrate processing apparatus and method that includes a film forming part to create a metal-containing film, a cleaning part to apply a first chemical liquid at a specific position on the substrate's edge, and a second chemical liquid at a position closer to the periphery after the first has dried, effectively preventing further metal component elution and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical liquid is supplied to clean the metal-containing film on the substrate edge, then the film cleaning effect is improved, but metal contamination increases due to dissolution and elution
Solution Approach 1:
The patent applies preliminary action by drying the metal-containing film at a first position before supplying chemical liquid to a second position. This sequence prevents the chemical liquid from dissolving and eluting metal components, as the film is already dried and stabilized. The drying step performed beforehand eliminates the harmful effect of metal contamination while maintaining effective film cleaning.
Solution Approach 2:
The patent segments the substrate edge into multiple positions (first position and second position) and applies different treatments to each. The first position undergoes drying treatment, while the second position receives chemical liquid supply. This spatial segmentation allows the process to achieve both film cleaning and contamination prevention by treating different areas with appropriate methods.
2Reliability
If metal-containing film is used on the substrate, then the film formation function is achieved, but metal components elute during processing causing contamination
Solution Approach 1:
The patent performs preliminary drying treatment on the metal-containing film at a first position before any chemical liquid is supplied to other positions. This preliminary action stabilizes the film structure and prevents metal component elution during subsequent chemical processing, thereby maintaining both the film's functional integrity and preventing contamination.
Solution Approach 2:
The patent applies preliminary anti-action by drying the metal-containing film before chemical liquid contact. This preliminary opposite action (drying instead of immediate chemical treatment) counteracts the potential harmful effect of metal elution, preventing contamination before it can occur during the chemical cleaning process.
3Manufacturing precision
If chemical liquid is supplied to the peripheral edge portion, then the metal-containing film is dissolved and removed, but metal contamination occurs on the substrate
Solution Approach 1:
The patent applies preliminary drying treatment to the metal-containing film at a first position before supplying chemical liquid to a second position. This preliminary action removes the solvent and stabilizes the film structure, preventing metal component elution when the chemical liquid is subsequently applied for film removal, thus achieving both efficient removal and contamination prevention.
Solution Approach 2:
The patent segments the peripheral edge portion into multiple positions and applies different treatments: drying at the first position and chemical liquid supply at the second position. This segmentation allows the chemical liquid to effectively remove the film while the previously dried areas prevent metal contamination, achieving both removal efficiency and substrate protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces metal contamination by ensuring the metal-containing film is dried before the second chemical liquid is applied, preventing it from dissolving and causing further metal component elution, thus minimizing contamination on the substrate.
Implementation Method 1
supply a first chemical liquid having a function of dissolving the metal-containing film to a first position in the peripheral edge portion of the substrate
Implementation Method 2
after the metal-containing film dissolved by the first chemical liquid is dried
Implementation Method 3
supply a second chemical liquid having a function of dissolving the metal-containing film to a second position in the peripheral edge portion of the substrate
Data Source
AI summary
There is provided a substrate processing apparatus, including: a film forming part configured to form a metal-containing film on a front surface of a substrate; a film cleaning part configured to clean the metal-containing film formed on a peripheral edge portion of the substrate; and a controller. The controller is configured to control the film forming part so as to form the metal-containing film on the front surface of the substrate, and control the film cleaning part so as to supply a first chemical liquid and a second chemical liquid.