Substrate Edge Film Removal with Dual-Nozzle Flow Control
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Solution Overview
Problem
Existing substrate processing technologies struggle to reduce the width of the exposed portion of a film on a substrate's upper surface, leading to inefficiencies in chip formation areas and potential defects such as voids.
Innovation Solution
A substrate processing apparatus that includes a substrate rotating unit, a first nozzle supplying a processing liquid from above to inhibit film removal, a second nozzle supplying a processing liquid from below to remove the film, and a control unit managing the rotation and liquid supply to control the film removal process, ensuring the boundary between covered and exposed portions is precise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a chemical solution is supplied to the horizontal surface of the rotating substrate to remove the peripheral portion of the film, then the film removal process is simplified, but the width of the exposed portion on the upper surface increases
Solution Approach 1:
The film removal process is segmented into two distinct stages: first removing the film from the bevel surface, then removing the film from the horizontal surface. This segmentation allows precise control over the exposed portion width by managing the boundary formation process in two controlled steps rather than one uncontrolled step
Solution Approach 2:
The bevel surface film removal is performed as a preliminary action before horizontal surface removal. This preliminary removal creates a controlled transition zone that prevents uncontrolled exposure on the horizontal surface, thereby reducing the width of the exposed portion while maintaining process simplicity
2Manufacturing precision
If the substrate rotation speed is increased to control the chemical solution flow, then the film removal uniformity is improved, but the processing time increases
Solution Approach 1:
The substrate rotation speed is varied periodically during the film removal process - rotating at a first speed during bevel surface removal and at a second speed during horizontal surface removal. This periodic speed variation optimizes film removal uniformity at each stage while minimizing total processing time by using the lowest necessary speed for each specific removal phase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces the width of the exposed film portion, expanding the effective chip formation area and minimizing defects by stabilizing the film removal process, particularly by controlling the rotational speed and liquid flow direction.
Implementation Method 1
A chemical solution is supplied to the horizontal surface of the upper surface of the rotating substrate, and then flows outwards in the radial direction by a centrifugal force
Implementation Method 2
a first nozzle that supplies a first processing liquid toward the substrate from above the substrate held by the substrate rotating unit, thereby inhibiting removal of the film
Implementation Method 3
a second nozzle that supplies a second processing liquid toward the substrate from below the substrate held by the substrate rotating unit, thereby removing the film
Data Source
AI summary
A substrate processing device removes the peripheral edge section of a film formed on an upper surface of a substrate. This substrate processing device comprises: a substrate rotating part which horizontally holds and rotates the substrate; a first nozzle which supplies, toward the substrate, a first processing fluid for hindering the removal of the film, from above the substrate held by the substrate rotating part; a second nozzle which supplies, toward the substrate, a second processing fluid for removing the film, from below the substrate held by the substrate rotating part; and a control unit which controls the rotation of the substrate, the supply of the first processing fluid, and the supply of the second processing fluid. The control unit, while the substrate is rotated at a first rotation speed by the substrate rotation part, supplies the first processing fluid by means of the first nozzle, and supplies the second processing fluid by means of the second nozzle, thereby performing control for removing the peripheral edge section of the film.