Substrate Edge Observation Layout for Heat-Isolated Bevel Processing
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Solution Overview
Problem
The existing substrate processing apparatus lacks an observing mechanism for accurately monitoring the peripheral edge of substrates before and after bevel processing, leading to reduced productivity and potential inaccuracies due to thermal effects from the heating mechanism.
Innovation Solution
A substrate processing apparatus is designed with a chamber, a substrate holder, a heating mechanism using a gas discharge nozzle, a processing liquid discharge nozzle, and an observing mechanism with a light source and image pickup part positioned away from the heater to minimize thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a semiconductor wafer inspection apparatus is incorporated into the substrate processing apparatus to observe the peripheral edge part, then the observation function is provided, but the observation accuracy is reduced due to thermal effects from the heater
Solution Approach 1:
The observing mechanism (light source part and image pickup part) is extracted from the heated internal space and disposed outside the chamber. This separates the observation function from the thermal environment, allowing accurate imaging without thermal interference while maintaining the heating function inside the chamber.
Solution Approach 2:
The chamber wall acts as an intermediary barrier between the heater inside and the observing mechanism outside. This physical separation allows the observation of the substrate through the chamber wall while preventing thermal transfer to the optical components, thus maintaining observation accuracy.
2Productivity
If no observing mechanism is provided in the substrate processing apparatus, then the thermal effect on observation is avoided, but productivity is reduced due to the need to convey substrates to external inspection apparatus
Solution Approach 1:
The observing mechanism is merged with the substrate processing apparatus by integrating the light source part and image pickup part into the chamber structure. This combination allows simultaneous processing and observation without substrate transfer, improving productivity while maintaining observation accuracy through proper thermal isolation.
Solution Approach 2:
The chamber structure serves multiple functions: it contains the heated processing environment, provides a barrier against thermal effects, and supports the observing mechanism for in-situ inspection. This multi-functionality enables both processing and observation within a single integrated system.
3Ease of operation
If the light source part and image pickup part are disposed near the heater to observe the substrate, then the observation function is provided, but the observation accuracy is reduced due to temperature change from the heater
Solution Approach 1:
The light source part and image pickup part are extracted from the heated internal space and disposed outside the chamber. This separation eliminates thermal interference with the optical components while maintaining the ability to observe the substrate through the chamber wall.
Solution Approach 2:
The chamber wall serves as an intermediary that allows optical observation while blocking thermal transfer. The observing mechanism can be positioned close to the substrate for good observation conditions without being exposed to the heater's thermal effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high-accuracy observation of the substrate's peripheral edge while suppressing thermal effects, enhancing the quality of substrate processing and maintaining observation accuracy.
Implementation Method 1
a heater (471) attached to an outer wall of the chamber, and a pipe (46) configured to feed an inert gas heated by the heater (471) to the gas discharge nozzle (45)
Implementation Method 2
heat the substrate held by the substrate holder by supplying the inert gas from the gas discharge nozzle onto the substrate
Implementation Method 3
supplying the inert gas heated by the heater (471) to the gas discharge nozzle (45), and being configured to heat the substrate held by the substrate holder by supplying the inert gas from the gas discharge nozzle (45) onto the substrate
Implementation Method 4
the light source part configured to illuminate the peripheral edge part of the substrate held by the substrate holder with illumination light
Implementation Method 5
the image pickup part configured to image the peripheral edge part of the substrate illuminated with the illumination light
Data Source
AI summary
In a substrate processing apparatus according to the present invention, a heating mechanism for heating a substrate includes a gas discharge nozzle arranged in an internal space, a heater attached to an outer wall of a chamber, and a pipe feeding to the discharge nozzle. An observing mechanism includes a light source part and an image pickup part which are arranged at a separation position away from an attachment portion in the outer wall of the chamber. Thus, the light source part and the image pickup part become less susceptible to an effect of heat generated by the heater. In other words, it is possible to prevent the reduction in the observation accuracy due to an effect of temperature change.