Substrate Edge Sensing for Accurate Holder Matching
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Solution Overview
Problem
In semiconductor manufacturing, there is a risk of damaging substrate holders and substrates due to mismatches in size and shape, leading to potential waste and equipment damage.
Innovation Solution
A semiconductor manufacturing apparatus equipped with sensor pairs to accurately measure the size and shape of substrates, including edge detection and light-based measurement systems, to identify the correct substrate holder matching the substrate's dimensions and shape, and to detect deviations or warps, ensuring appropriate handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate size and shape are not accurately measured, then processing speed is maintained, but substrate holder damage and substrate wastage occur
Solution Approach 1:
The sensor pairs measure substrate size and shape before the substrate is mounted on the holder, enabling preliminary identification of compatibility. This prevents damage by ensuring correct matching in advance, without slowing down the overall processing flow.
Solution Approach 2:
The patent replaces manual visual inspection or mechanical measurement methods with optical sensor pairs that automatically detect substrate edges and calculate dimensions. This substitution enables fast, accurate measurement that does not compromise processing speed while ensuring reliability.
2Measurement precision
If multiple sensor pairs are added to measure substrate dimensions accurately, then measurement precision improves, but device complexity increases
Solution Approach 1:
The measurement system is segmented into multiple sensor pairs, each responsible for measuring specific dimensions (width, length, diagonals) independently. This segmentation allows accurate measurement of each parameter while keeping individual sensor units simple and manageable.
Solution Approach 2:
Each sensor pair is designed to be multi-functional, capable of detecting edge positions and calculating multiple dimensions (width, length, diagonals) from the same hardware. This universality reduces overall system complexity by avoiding redundant specialized sensors for each measurement.
3Manufacturing precision
If substrate size is measured before mounting, then substrate holder matching accuracy improves, but processing time increases
Solution Approach 1:
Optical sensor pairs replace slow manual measurement methods, enabling rapid automated detection of substrate dimensions before mounting. The electronic calculation of dimensions and matching decisions occurs instantly, minimizing added processing time while maximizing matching accuracy.
Solution Approach 2:
The measurement and matching decision are performed as preliminary actions before the substrate mounting process begins. By identifying compatibility issues in advance, the system prevents rework and adjustments that would otherwise consume more time during or after mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate holder damage and substrate wastage by ensuring correct matching of substrate holders with substrates, allowing for safe and efficient processing while identifying and addressing any shape or size deviations.
Implementation Method 1
a light emitter which emits belt-shaped measuring light toward the rectangular substrate, and a light receiver which receives a part of the belt-shaped measuring light, wherein the part of the belt-shaped measuring light is light, in the belt-shaped measuring light, that was not blocked by the rectangular substrate
Data Source
AI summary
The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectangular substrate. This semiconductor manufacturing device: comprises a first sensor pair, which is used to measure a first length of the rectangular substrate along a first line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the first line and a sensor configured to detect the position of the other end of the rectangular substrate on the first line, and a second sensor pair, which is used to measure a second length of the rectangular substrate along a second line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the second line and a sensor configured to detect the position of the other end of the rectangular substrate on the second line; and identifies the size or shape of the rectangular substrate on the basis of the first length and the second length.