Substrate Edge Induction Heating for Uniform Wafer Processing
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Solution Overview
Problem
Existing substrate processing methods face challenges in maintaining uniform temperature distribution, particularly at the edge regions, due to varying rotational velocities and inadequate heating mechanisms, leading to uneven treatment of substrates during high-temperature processes.
Innovation Solution
A substrate processing apparatus and method that utilizes a support unit with a magnet unit for induction heating of the edge region, incorporating a metal insertion body within the chuck pin and a plurality of magnets spaced along the support plate's circumference to induce heating uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is rotated at high speed during treatment, then the treatment solution can be evenly distributed across the substrate surface, but the temperature at the edge region drops more easily due to higher rotational velocity
Solution Approach 1:
The patent applies local quality by installing heating units specifically at the edge region of the substrate support, rather than uniform heating across the entire substrate. This targeted local heating compensates for the temperature drop at the edge region caused by high rotational velocity, while allowing the center region to maintain its temperature through the treatment solution flow pattern.
Solution Approach 2:
The heating unit pre-heats the treatment solution before it reaches the edge region of the substrate, or pre-heats the edge region itself, to counteract the cooling effect that occurs during high-speed rotation. This preliminary anti-action prevents the temperature drop before it fully occurs, maintaining uniform temperature distribution.
2Temperature
If a heater is installed in the support unit, then the substrate can be heated, but the heater cannot be provided to the extent that the front surface of the substrate can be heated
Solution Approach 1:
The patent introduces a heating unit that acts as an intermediary between the support unit and the substrate front surface. This heating unit is positioned to directly heat the treatment solution or the substrate edge region, serving as a mediator that transfers thermal energy more effectively to the substrate surface without requiring complex heating elements embedded in the support unit structure.
Solution Approach 2:
The heating approach transitions from a two-dimensional heating plane (heater in the support unit plane) to a three-dimensional heating configuration where the heating unit is positioned above or near the substrate edge region, allowing thermal energy to reach the substrate front surface from a different spatial dimension.
3Temperature
If the treatment solution is heated to high temperature, then the substrate can be treated at high temperature, but the temperature uniformity of the treatment solution is not maintained
Solution Approach 1:
The heating unit provides localized heating specifically at the edge region where temperature uniformity is most critical. This local heating compensates for the temperature gradients that develop in the treatment solution during substrate rotation, maintaining uniform temperature distribution across the entire treatment solution volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved temperature uniformity across the substrate by inductively heating the edge regions, ensuring consistent treatment quality and effectiveness during high-temperature processes.
Implementation Method 1
a magnet unit for heating the insertion body by an induction heating manner
Data Source
AI summary
The substrate processing apparatus includes a housing for providing a treatment space to treat a substrate; a support unit positioned in the treatment space and for supporting the substrate; a nozzle for supplying a treatment solution to the substrate supported on the support unit; and a heating unit for heating an edge region of the substrate supported on the support unit, in which the support unit includes a support plate on which the substrate is placed; a pin for supporting the substrate placed on the support plate; and a drive unit for rotating the support plate, and the heating unit includes an insertion body made of metal located within the chuck pin; and a magnet unit for heating the insertion body by an induction heating manner.