Substrate Edge Laser Ablation for Selective Film Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate treating methods using chemical spraying for edge bead removal are inefficient, leading to incomplete film removal and potential contamination due to improper film removal techniques, which reduces production yield and increases the risk of pin marks on the substrate surface.
Innovation Solution
A substrate treating method and apparatus that utilizes multiple unit pulse laser beams with varying wavelengths to efficiently remove films from substrates, allowing for sequential treatment of different films stacked on the substrate, minimizing the film removal region and optimizing the process by varying the wavelength based on the type of film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical spraying is used for edge bead removal, then the process is simple to implement, but the film removal is incomplete and contamination occurs
Solution Approach 1:
The patent replaces the chemical spraying method with a laser-based method. Specifically, a laser beam is irradiated onto the edge region of the substrate to remove the film through ablation, eliminating the need for chemical solutions and achieving complete, clean film removal without contamination.
Solution Approach 2:
The patent utilizes adjustable laser parameters (wavelength, pulse duration, power) to optimize film removal. By changing these parameters, the laser can effectively remove different types of films (organic, inorganic, metal) while maintaining precision and avoiding substrate damage.
2Ease of operation
If chemical spraying is used for edge bead removal, then the process is straightforward, but production yield is reduced
Solution Approach 1:
The laser-based method replaces chemical spraying, enabling more precise and controllable film removal. This improves production yield by eliminating incomplete removal and contamination issues that occur with chemical methods, while maintaining operational simplicity through automated laser scanning.
3Device complexity
If chemical spraying is used for edge bead removal, then the setup is simple, but pin marks form on the substrate surface
Solution Approach 1:
The patent replaces chemical spraying with laser ablation, which removes film through direct energy interaction without introducing chemical contaminants. This eliminates pin marks and surface contamination while keeping the system relatively simple through the use of a laser source and scanning mechanism.
4Productivity
If multiple wavelengths of laser beams are used for film removal, then film removal efficiency and selectivity are improved, but device complexity increases
Solution Approach 1:
The patent employs a laser system capable of operating at multiple wavelengths to handle different types of films (organic, inorganic, metal). This multi-functional approach allows a single device to effectively remove various film compositions, improving overall productivity and versatility while managing complexity through integrated laser technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high-efficiency film removal with improved selectivity and reduced contamination, maximizing production yield by ensuring precise and uniform film ablation, even in complex film stacks, and minimizing the film removal region.
Implementation Method 1
irradiating a laser beam having a wavelength of 150 nm to 1200 nm onto a film on a substrate
Data Source
AI summary
An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.