Substrate Edge Heating Layout Using Inclined LED Irradiation
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently heating the peripheral edge parts of substrates due to layout restrictions, which limits the ability to shorten tact time during processing.
Innovation Solution
A substrate processing apparatus that utilizes a light emitting element, such as an LED, as a heating source, arranged below the substrate and inclined to face the peripheral edge, allowing for efficient heating of the substrate's edge region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the LED is arranged at a position right below the lower surface peripheral edge part of the substrate, then the heating efficiency of the peripheral edge part is improved, but the arrangement space is limited due to layout restrictions of apparatus components
Solution Approach 1:
The LED is arranged in the vertical dimension below the substrate rather than in the horizontal plane, allowing the light emitting surface to face the peripheral edge part of the substrate from below. This dimensional change enables efficient heating of the peripheral edge part while avoiding conflicts with other apparatus components in the horizontal arrangement space.
2Ease of manufacture
If the LED is arranged away from the end surface of the substrate toward the axis of rotation, then the layout restrictions are satisfied, but the heating speed of the peripheral edge part is reduced
Solution Approach 1:
The LED is arranged asymmetrically with its light emitting surface inclined relative to the substrate, positioning it to face the peripheral edge part specifically. This asymmetric arrangement allows the LED to be located away from the end surface toward the axis of rotation while still effectively heating the peripheral edge region through its inclined light emission direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables rapid heating of the substrate's peripheral edge, thereby reducing processing time and improving efficiency within the constraints of the apparatus layout.
Implementation Method 1
heating the substrate by irradiating light to one principal surface of the substrate, the light being emitted from a light emitting surface of a light emitting element
Data Source
AI summary
A light emitting element is positioned at a position right below one principal surface of a substrate rotating about an axis of rotation and away from an end surface of the substrate toward the axis of rotation. The light emitting element is arranged as to be inclined from a horizontal plane so that the light emitting surface faces a peripheral edge part of the substrate. Light emitted from the light emitting surface of the light emitting element is irradiated to a lower surface peripheral edge part of the substrate or a region near the lower surface peripheral edge part. As a result, a processing by the processing liquid is possible in a short time.