Substrate Coating Edge Removal to Prevent Metal Contamination
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Solution Overview
Problem
The formation of metal-containing coating films on substrates leads to metal contamination due to residual metal components in the peripheral portions, which can contaminate the substrate processing apparatus and adjacent exposure devices.
Innovation Solution
A substrate processing apparatus and method that forms a metal-containing coating film on the substrate surface, followed by a peripheral portion removal process using a removal liquid to dissolve the metal in the peripheral region, preventing metal contamination by ensuring the metal-containing coating film remains only on the intended surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a metal-containing coating film is formed on the entire substrate surface, then the coating coverage is improved, but metal contamination occurs in the peripheral portion
Solution Approach 1:
The substrate surface is divided into a central region and a peripheral region. The metal-containing coating film is selectively formed only on the central region, while the peripheral region is excluded from coating. This segmentation prevents metal contamination in the peripheral portion while maintaining adequate coating coverage on the functional central area.
Solution Approach 2:
Different regions of the substrate are given different properties: the central region receives the metal-containing coating film for its specific functional requirements, while the peripheral region is kept free of metal coating to prevent contamination. This local differentiation allows each region to have the appropriate quality for its intended use.
2Object-generated harmful factors
If the peripheral portion of the substrate is removed after coating, then metal contamination is prevented, but the substrate processing complexity increases
Solution Approach 1:
The peripheral portion removal is performed as a preliminary step before forming the metal-containing coating film. By removing the peripheral portion first, the substrate is prepared with a reduced area that will receive the coating, ensuring that metal contamination cannot occur in the first place. This preliminary action simplifies the overall process by preventing contamination rather than requiring complex removal and cleaning steps afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents metal contamination by effectively removing metal from the peripheral portion of the substrate, allowing the formation of a uniform metal-containing coating film without adhering to transport mechanisms, thus maintaining apparatus cleanliness and reducing processing costs.
Implementation Method 1
supplies a first removal liquid for dissolving the metal to a peripheral portion of the substrate such that the metal-containing coating film remains in a region except for the peripheral portion
Data Source
AI summary
A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.