Substrate Edge Nozzle Control for Notch-Induced Particle Reduction
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Solution Overview
Problem
Conventional substrate processing techniques fail to effectively suppress particle occurrence when processing substrates with cuts at their peripheral edges due to liquid splash and scattering, especially when the nozzle moves across the cut during rotation.
Innovation Solution
A substrate processing apparatus and method that involves a rotating substrate holder, a processing liquid supplier with a movable nozzle, and a controller to adjust operating conditions such that the nozzle moves outward from the substrate's edge, crosses over a cut, and returns, switching conditions at an intermediate position to reduce the amount of processing liquid reaching the cut, thereby minimizing liquid splash and particle formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the nozzle moves across the cut during substrate rotation to supply processing liquid, then the processing coverage is improved, but liquid splash and particle occurrence increase
Solution Approach 1:
The nozzle is made movable in the radial direction of the substrate, allowing dynamic adjustment of the nozzle position. The controller coordinates the nozzle movement with substrate rotation to optimize the processing path, enabling the nozzle to supply processing liquid effectively while avoiding excessive liquid accumulation at the cut that causes splash and particle generation
Solution Approach 2:
The system changes multiple parameters including nozzle position (radial movement), substrate rotation speed, and processing liquid discharge amount. By dynamically adjusting these parameters in coordination, the system achieves effective processing coverage while controlling the amount of liquid reaching the cut to prevent splash and particle formation
2Productivity
If the substrate rotation speed is increased to reduce processing time, then productivity is improved, but liquid splash at the cut becomes more severe
Solution Approach 1:
The system dynamically adjusts substrate rotation speed based on the nozzle position and processing stage. By coordinating variable rotation speed with radial nozzle movement, the system maintains effective processing at higher speeds while controlling liquid discharge timing to minimize splash at the cut
Solution Approach 2:
The coordinated movement of the radially movable nozzle and rotating substrate creates periodic processing cycles. The controller synchronizes the nozzle passage over the cut with the rotation period, creating controlled intervals of liquid application that reduce cumulative splash and particle generation while maintaining high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses the occurrence of particles by optimizing the movement and discharge of processing liquid across the substrate's edge, particularly at cuts, enhancing the processing efficiency and reducing contamination.
Implementation Method 1
a substrate holder configured to hold a substrate provided with a cut at part of a peripheral edge part thereof in a horizontal posture, being rotatable about an axis of rotation
Implementation Method 2
a processing liquid supplier having a nozzle to discharge a processing liquid so as to supply the processing liquid to the peripheral edge part of the substrate
Data Source
AI summary
In this invention, a substrate with a notch on its periphery is rotated and a processing fluid is discharged from a nozzle while the nozzle is moved outward from an outside of the substrate through an edge surface of the substrate to the maximum processing position, which is a predetermined bevel processing distance away from the edge surface, and then the nozzle is returned in the opposite direction of the outward movement. Operating conditions including a rotation of the substrate, a discharge of the processing liquid, and the movement of the nozzle are not fixed but are switched at an intermediate position between the end surface and the maximum processing position.